公开(公告)号：US20240071995A1

公开(公告)日：2024-02-29

申请号：US18212461

申请日：2023-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Raeyoung Kang ,  Minki Kim ,  Hyuekjae Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/522 ,  H01L23/538

CPC classification number: H01L25/0652 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5384 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/16 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L2224/05147 ,  H01L2224/08113 ,  H01L2224/08148 ,  H01L2224/0903 ,  H01L2224/09051 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/215 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/73209 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1441

Abstract: A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode passing through the first semiconductor layer in a vertical direction, and a first bonding pad connected to the first through-electrode, and a second semiconductor chip including a second semiconductor layer on the first semiconductor chip, a wiring structure between the second semiconductor layer and the first semiconductor chip, a wiring pad connected to the wiring structure below the wiring structure, and a second bonding pad connected to the wiring pad below the wiring pad and in contact with the first bonding pad, wherein the second bonding pad includes a protrusion protruding toward the wiring pad.