公开(公告)号：US20240288834A1

公开(公告)日：2024-08-29

申请号：US18624262

申请日：2024-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyun KIM ,  Junghyun KANG ,  Kijung KIM ,  Shinhun MOON ,  Seunghyun CHO ,  Seongho HONG

IPC: G04G19/00 ,  A61B5/00 ,  A61B5/024 ,  G04G9/00 ,  G04G21/02 ,  H02J7/00 ,  H02J50/00 ,  H02J50/10 ,  H05K1/02 ,  H05K5/00

CPC classification number: G04G19/00 ,  G04G9/007 ,  G04G21/025 ,  H02J7/0042 ,  H02J50/005 ,  H05K1/028 ,  H05K5/0026 ,  A61B5/02416 ,  A61B5/681 ,  H02J50/10 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.

公开(公告)号：US20240036612A1

公开(公告)日：2024-02-01

申请号：US18352580

申请日：2023-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongheon JANG ,  Junghyun KANG ,  Taegyun KIM ,  Sanghwa LEE ,  Seongho HONG ,  Chungsoon PARK

IPC: G06F1/16 ,  H05K1/18 ,  H04R1/28

CPC classification number: G06F1/1658 ,  H05K1/181 ,  H04R1/2876 ,  G06F1/163 ,  H05K2201/10015 ,  H05K2201/10151

Abstract: A wearable electronic device is provided. The wearable device includes a bracket, a printed circuit board that at least partially faces a first surface of the bracket, a sound sensor structure disposed on a second surface of the bracket, a biometric sensor structure that overlaps the first surface of the bracket with respect to a direction that is perpendicular to the printed circuit board, and a damping structure interposed between the biometric sensor structure and the printed circuit board. The damping structure may elastically support the biometric sensor structure and the printed circuit board.

公开(公告)号：US20220330439A1

公开(公告)日：2022-10-13

申请号：US17708295

申请日：2022-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyun KIM ,  Junghyun KANG ,  Kijung KIM ,  Shinhun MOON ,  Seunghyun CHO ,  Seongho HONG

IPC: H05K5/00 ,  H05K1/02 ,  H02J7/00 ,  H02J50/00 ,  G04G21/02 ,  G04G9/00

Abstract: An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.