-
公开(公告)号:US20170149158A1
公开(公告)日:2017-05-25
申请号:US15272560
申请日:2016-09-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chungsoon PARK , Junghyun KANG , Hyunmin SEO , Seung-Ho LEE , So-Young LEE
IPC: H01R13/24
CPC classification number: H01R13/2421 , H01R12/7082 , H01R13/18
Abstract: An electronic device may include a substrate including a first surface facing a first direction, and a second surface facing a second direction, the second direction being opposite to the first direction; a first connector arranged on the first surface, wherein the first connector includes a first hollow member extending in the first direction; a first movable conductive member inserted in the first hollow member and movable in the first direction; and a first elastic member for supporting the first movable conductive member; a second connector arranged on the second surface and aligned with the first connector in the first direction, wherein the second connector includes a second hollow member extending in the first direction, a second movable conductive member inserted into the second hollow member and movable in the first direction, and a second elastic member for supporting the second movable conductive member.
-
2.
公开(公告)号:US20210093198A1
公开(公告)日:2021-04-01
申请号:US17043388
申请日:2019-04-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chungsoon PARK , Kyungmin KIM , Sujin PARK , Hyunggon KIM
Abstract: Disclosed is an electronic device comprising: a biometric sensor, including at least one light emitting diode (LED) and at least one light receiving unit, for acquiring biometric information by means of the at least one light emitting device and the at least one light receiving unit; a power receiving circuit configured to receive a wireless power signal from an external electronic device; and a processor operatively coupled to the biometric sensor and the power receiving circuit. The processor may be configured to receive a designated wireless power signal from the external electronic device by using the power receiving circuit and to perform optical communication with the external electronic device by using the biosensor when the designated wireless power signal is received. Other various embodiments identified from the specification are also possible.
-
3.
公开(公告)号:US20240277226A1
公开(公告)日:2024-08-22
申请号:US18650981
申请日:2024-04-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chungsoon PARK , Kyungmin KIM , Sujin PARK , Hyunggon KIM
CPC classification number: A61B5/0017 , A61B5/0059 , H02J7/00045 , H02J7/0047 , H02J7/04 , H02J50/12 , H02J50/20 , H02J50/80 , H04B10/502 , H04B10/69 , A61B2562/0233
Abstract: An electronic device is provided comprising: a biometric sensor, including at least one light emitting diode (LED) and at least one light receiving unit, for acquiring biometric information by means of the at least one light emitting device and the at least one light receiving unit; a power receiving circuit configured to receive a wireless power signal from an external electronic device; and a processor operatively coupled to the biometric sensor and the power receiving circuit. The processor may be configured to receive a designated wireless power signal from the external electronic device by using the power receiving circuit and to perform optical communication with the external electronic device by using the biosensor when the designated wireless power signal is received. Other various embodiments identified from the specification are also possible.
-
公开(公告)号:US20170164089A1
公开(公告)日:2017-06-08
申请号:US15347168
申请日:2016-11-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seung-Ho LEE , Yong-Yi KIM , Chungsoon PARK , Yongjin SHIN
IPC: H04R1/10
CPC classification number: H04R1/1025 , H04R1/1016 , H04R5/04 , H04R2420/07
Abstract: An electronic device is provided. The electronic device includes a wireless communication circuit; a processor connected to the communication circuit; and a memory connected to the processor, wherein the processor is configured to establish a connection to a first and second earpiece by the wireless communication circuit; receive, from the first earpiece, a first data related to a charging level of a first battery included in the first earpiece by the communication circuit; receive, from the first earpiece or the second earpiece, a second data that is related to a charging level of a second battery in the second earpiece by the communication circuit; and transmit, to at least one of the first earpiece or the second earpiece, one or more control signals that enable the first earpiece and the second earpiece to operate differently from each other based on the first and second data.
-
公开(公告)号:US20250147560A1
公开(公告)日:2025-05-08
申请号:US19002262
申请日:2024-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chungsoon PARK , Junghyun KANG , Hyohoon SHIN , Jeongho AHN , Heeyoung YUN , Jonggwang JANG , Dongheon JANG
Abstract: Provided is an electronic device including a motor housing. The electronic device including at least one heat generating element may include a printed board assembly on which the heat generating element is disposed; a battery; a battery support frame configured to support the battery therein; and a motor disposed between the printed board assembly and the battery support frame. The motor may include a motor housing including a first surface configured to directly or indirectly contact the printed board assembly and to receive a heat of the heat generating element from the printed board assembly, and a second surface configured to directly or indirectly contact the battery support frame and to transfer a heat of the heat generating element to the battery support frame.
-
公开(公告)号:US20240284621A1
公开(公告)日:2024-08-22
申请号:US18443913
申请日:2024-02-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chungsoon PARK , Jeongho AHN , Bareum PARK , Yangji JEON
CPC classification number: H05K5/0273 , H05K1/0219 , H05K1/111 , H05K5/003 , H05K2201/10037 , H05K2201/10098
Abstract: According to an embodiment of the disclosure, an electronic device may include: a housing, a printed circuit board disposed in the housing, the printed circuit board including a wireless communication module comprising communication circuitry, a radio frequency switch, a first electronic component comprising circuitry, and a second electronic component, comprising circuitry, electrically connected to the radio frequency switch, and a shield can disposed on the printed circuit board to cover at least a partial area of the printed circuit board and including multiple pads in contact with the printed circuit board, and an antenna module, comprising at least one antenna, configured to transmit and/or receive signals and/or power between external electronic devices using at least part of the housing and at least part of the shield can, wherein the multiple pads include a first pad electrically connected to the radio frequency switch and a second pad electrically connected to the first electronic component, the multiple pads are configured to be electrically isolated from the printed circuit board, and the radio frequency switch is configured to select one of a first path configured to cause the antenna module to have a first radiation efficiency based on a signal of a first frequency band provided from the wireless communication module being applied to the first path, and a second path configured to cause the antenna module to have a second radiation efficiency different from the first radiation efficiency based on a signal of the first frequency band being applied to the second path, and is connected to the second electrical component.
-
公开(公告)号:US20240036612A1
公开(公告)日:2024-02-01
申请号:US18352580
申请日:2023-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongheon JANG , Junghyun KANG , Taegyun KIM , Sanghwa LEE , Seongho HONG , Chungsoon PARK
CPC classification number: G06F1/1658 , H05K1/181 , H04R1/2876 , G06F1/163 , H05K2201/10015 , H05K2201/10151
Abstract: A wearable electronic device is provided. The wearable device includes a bracket, a printed circuit board that at least partially faces a first surface of the bracket, a sound sensor structure disposed on a second surface of the bracket, a biometric sensor structure that overlaps the first surface of the bracket with respect to a direction that is perpendicular to the printed circuit board, and a damping structure interposed between the biometric sensor structure and the printed circuit board. The damping structure may elastically support the biometric sensor structure and the printed circuit board.
-
公开(公告)号:US20230361453A1
公开(公告)日:2023-11-09
申请号:US18224906
申请日:2023-07-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chungsoon PARK , Youngjae KO , Kijung KIM , Junghyun KANG , Hyohoon SHIN , Yongsang YUN
Abstract: An electronic device includes: a conductive housing; a main circuit board; and a biometric circuit board configured to measure body information, wherein the biometric circuit board may include: a first connection point at which a first conductive connection member contacts the biometric circuit board, the first conductive connection member being configured to electrically connect the conductive housing and the biometric circuit board; a second connection point at which a second conductive connection member contacts the biometric circuit board, the second conductive connection member being configured to electrically connect a biometric button and the biometric circuit board; and a third connection point at which a third conductive connection member contacts the biometric circuit board, the third conductive connection member being configured to electrically connect the main circuit board and the biometric circuit board, and the conductive housing may include a first shorting point electrically connected to the biometric circuit board and the main circuit board to provide an antenna path.
-
-
-
-
-
-
-