公开(公告)号：US20240162323A1

公开(公告)日：2024-05-16

申请号：US18489220

申请日：2023-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoo Shin ,  Sangcheol Na ,  Minjae Kang ,  Yongjin Kwon ,  Soeun Kim ,  Jongmin Baek

IPC: H01L29/423 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/06 ,  H01L29/08 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/42392 ,  H01L21/823475 ,  H01L27/088 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/775 ,  H01L29/78696

Abstract: The integrated circuit device includes a substrate, a first fin extending in a first horizontal direction on the substrate, a second fin and a third fin spaced apart from each other in the first horizontal direction and extending in the first horizontal direction, a second source/drain area on the second fin and the third fin, a back side contact between the second fin and the third fin and electrically connected to the second source/drain area, and a back side conductive layer extending in the first horizontal direction and electrically connected to the back side contact. The back side contact includes a first portion protruding from the substrate and a second portion that is coplanar, in a vertical direction, with the substrate. A width of the second portion in the second horizontal direction is greater than a width of the first portion in the second horizontal direction.