公开(公告)号：US09455165B2

公开(公告)日：2016-09-27

申请号：US14660093

申请日：2015-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yisung Hwang ,  Sugil Lee ,  Dongjun Kim ,  Yongdae Ha

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67703 ,  H01L21/68714

Abstract: A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.

Abstract translation: 芯片接合装置包括：支撑晶片的晶片保持器，其中形成管芯; 喷射器保持器，其设置在所述晶片保持器下方的所述晶片下方并支撑有助于将所述管芯与所述晶片分离的管芯喷射器; 支撑单元，其支撑待附接模具的基板; 接合单元，其从所述晶片拾取所述管芯并将所述拾取管芯附接到所述衬底; 一个接收喷射器的喷射器缓冲单元; 以及在喷射器保持器和喷射器缓冲器单元之间传送喷射器的替换单元。

公开(公告)号：US20250068329A1

公开(公告)日：2025-02-27

申请号：US18804693

申请日：2024-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)

Inventor： Jongeun Lee ,  Jaewoo Park ,  Sugil Lee

IPC: G06F3/06

Abstract: A memory device includes a memory cell array, an operator comprising a logic circuit configured to perform an operation comprising a plurality of stages, and a plurality of buffers configured to store first data and second data corresponding to a plurality of operation commands received from a host for each of the plurality of stages, respectively, wherein the operator comprises a butterfly unit configured to perform butterfly operations based on at least one of the first data and the second data.

公开(公告)号：US20150303081A1

公开(公告)日：2015-10-22

申请号：US14660093

申请日：2015-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yisung Hwang ,  Sugil Lee ,  Dongjun Kim ,  Yongdae Ha

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67703 ,  H01L21/68714

Abstract: A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.

Abstract translation: 芯片接合装置包括：支撑晶片的晶片保持器，其中形成管芯; 喷射器保持器，其设置在所述晶片保持器下方的所述晶片下方并支撑有助于将所述管芯与所述晶片分离的管芯喷射器; 支撑单元，其支撑待附接模具的基板; 接合单元，其从所述晶片拾取所述管芯并将所述拾取管芯附接到所述衬底; 一个接收喷射器的喷射器缓冲单元; 以及在喷射器保持器和喷射器缓冲器单元之间传送喷射器的替换单元。