公开(公告)号：US20150303081A1

公开(公告)日：2015-10-22

申请号：US14660093

申请日：2015-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yisung Hwang ,  Sugil Lee ,  Dongjun Kim ,  Yongdae Ha

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67703 ,  H01L21/68714

Abstract: A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.

Abstract translation: 芯片接合装置包括：支撑晶片的晶片保持器，其中形成管芯; 喷射器保持器，其设置在所述晶片保持器下方的所述晶片下方并支撑有助于将所述管芯与所述晶片分离的管芯喷射器; 支撑单元，其支撑待附接模具的基板; 接合单元，其从所述晶片拾取所述管芯并将所述拾取管芯附接到所述衬底; 一个接收喷射器的喷射器缓冲单元; 以及在喷射器保持器和喷射器缓冲器单元之间传送喷射器的替换单元。

公开(公告)号：US10211084B2

公开(公告)日：2019-02-19

申请号：US15215578

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin Kim ,  Youngsik Kim ,  Kunho Song ,  Yongdae Ha

IPC: B24B27/00 ,  H01L21/683 ,  B24B37/10 ,  B24B37/30 ,  B24B37/34 ,  H01L21/687 ,  B25B11/00

Abstract: A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.

公开(公告)号：US09455165B2

公开(公告)日：2016-09-27

申请号：US14660093

申请日：2015-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yisung Hwang ,  Sugil Lee ,  Dongjun Kim ,  Yongdae Ha

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67703 ,  H01L21/68714

Abstract: A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.

Abstract translation: 芯片接合装置包括：支撑晶片的晶片保持器，其中形成管芯; 喷射器保持器，其设置在所述晶片保持器下方的所述晶片下方并支撑有助于将所述管芯与所述晶片分离的管芯喷射器; 支撑单元，其支撑待附接模具的基板; 接合单元，其从所述晶片拾取所述管芯并将所述拾取管芯附接到所述衬底; 一个接收喷射器的喷射器缓冲单元; 以及在喷射器保持器和喷射器缓冲器单元之间传送喷射器的替换单元。

公开(公告)号：US09698117B2

公开(公告)日：2017-07-04

申请号：US14600324

申请日：2015-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongdae Ha ,  Jaeryoung Lee ,  Chulmin Kim ,  Yisung Hwang ,  Teaseog Um ,  Yongjin Jung

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L24/75 ,  H01L21/67144 ,  H01L21/6838 ,  H01L2221/68363 ,  H01L2224/7555 ,  H01L2224/7565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.

公开(公告)号：US11456273B2

公开(公告)日：2022-09-27

申请号：US16682840

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaecheol Kim ,  Gilman Kang ,  Yongdae Ha

IPC: B23K20/00 ,  H01L23/00 ,  B23K20/02 ,  B23K101/40

Abstract: A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.