公开(公告)号：US09880418B2

公开(公告)日：2018-01-30

申请号：US15012252

申请日：2016-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Kwon Lee ,  Sung Ok Kim ,  Dea Woo Ryu ,  Yong Gil Lee ,  Chang Ho Cho

IPC: G09F13/04 ,  G02F1/1335

CPC classification number: G02F1/133608 ,  G02F1/133603 ,  G02F2201/46

Abstract: A display apparatus is provided. The display apparatus includes a display panel, a substrate, and a bottom chassis. The substrate is provided with light sources to emit light towards the display panel. The substrate includes a fixing hole formed between the light sources. The substrate is coupled to the bottom chassis. The bottom chassis includes a fixing protrusion to be coupled to the fixing hole. The fixing protrusion is formed with the bottom chassis to have a detachment prevention structure so that the fixing protrusion is prevented from being detached from the fixing hole.

公开(公告)号：US12072370B2

公开(公告)日：2024-08-27

申请号：US17406553

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ok Kim ,  Min Woo Kim ,  Ho Gyung Kim ,  Dahm Yu ,  Jae Hyun Kim

IPC: G01R31/27 ,  G01R31/28 ,  G01R31/3183

CPC classification number: G01R31/275 ,  G01R31/2862 ,  G01R31/2872 ,  G01R31/2889 ,  G01R31/318314

Abstract: A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.