Injection molding apparatus
    1.
    发明授权

    公开(公告)号:US11534949B2

    公开(公告)日:2022-12-27

    申请号:US15733543

    申请日:2018-11-26

    Inventor: Yong Joo Park

    Abstract: Provided is an injection molding apparatus including a first mold and a second mold, an ejector plate provided on the first mold to reciprocate and configured to eject an injection molded object between the first mold and the second mold, and a sensor device having a moving sensor detachably attached to the ejector plate, and configured to detect a position of the ejector plate, wherein the sensor device is detachably attached to the first mold and the ejector plate by a magnetic force.

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