公开(公告)号：US20130168726A1

公开(公告)日：2013-07-04

申请号：US13677109

申请日：2012-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun-yong PARK ,  Dae-young KIM ,  Choo-ho KIM ,  Jomg-o LIM ,  Yong-rak JEONG

IPC: B29C45/14 ,  H01L33/52

CPC classification number: B29C45/14819 ,  B29C45/14655 ,  B29C45/2708 ,  B29C45/34 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device package mold and a method of manufacturing a lens of a light-emitting device package. The light-emitting device package mold includes a convex unit, an inner circumference of which has a hemispherical shape; a flat panel unit that forms a flat panel by extending from an edge of the convex unit; a cylindrical unit extending in a vertical direction with respect to an upper surface of the flat panel unit; and an injection hole and a discharge hole that penetrate through the convex unit, wherein the discharge hole is formed in a horizontal direction with respect to the flat panel unit.

Abstract translation: 发光器件封装模具和制造发光器件封装的透镜的方法。 发光装置封装模具包括：其内周具有半球形状的凸部; 平板组件，其通过从所述凸单元的边缘延伸而形成平板; 圆筒形单元，其相对于所述平板单元的上表面在垂直方向上延伸; 以及贯通凸部的注入孔和排出孔，其中，排出孔相对于平板单元在水平方向上形成。