公开(公告)号：US20240355791A1

公开(公告)日：2024-10-24

申请号：US18635197

申请日：2024-04-15

申请人： SEOUL VIOSYS CO., LTD.

发明人： NamGoo CHA ,  SungHyun LEE ,  ChungJae LEE

IPC分类号： H01L25/075 ,  H01L33/52 ,  H01L33/62

CPC分类号： H01L25/0756 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0066

摘要： A display module according to an embodiment includes: a circuit board; a light emitting device disposed on the circuit board; and a molding layer covering the light emitting device, the light emitting device, including: a first LED stack generating light of a first wavelength; a second LED stack disposed on the first LED stack and generating light of a second wavelength; and a third LED stack disposed on the second LED stack and generating light of a third wavelength, in which each of the first, second, and third LED stacks includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, and polarities of the first LED stack and the third LED stack disposed over and under the second LED stack are asymmetric with respect to the second LED stack.

公开(公告)号：US12125939B2

公开(公告)日：2024-10-22

申请号：US17078839

申请日：2020-10-23

申请人： NICHIA CORPORATION

发明人： Hidetoshi Tanaka

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/52

CPC分类号： H01L33/0093 ,  H01L33/504 ,  H01L33/52 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

摘要： A method of manufacturing a light-emitting device includes providing a structure body including a silicon substrate having a first portion, a second portion, and a third portion between the first portion and the second portion, and a first semiconductor layered body including a first light-emitting layer, the first semiconductor layered body being disposed on or above the silicon substrate. The method includes forming a first resin layer covering a lateral side of the silicon substrate and a lateral side of the first semiconductor layered body. The method includes a removal step of removing the first portion to expose a first surface of the first semiconductor layered body, removing the second portion to expose a second surface of the first semiconductor layered body, and leaving the third portion. The method includes forming a first wavelength conversion member on or above the first surface exposed by the removal of the first portion.

公开(公告)号：US12100691B2

公开(公告)日：2024-09-24

申请号：US17438776

申请日：2020-05-13

申请人： OSRAM Opto Semiconductors GmbH

发明人： Siegfried Herrmann

IPC分类号： H01L25/075 ,  H01L25/16 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62

摘要： The invention relates to a light-emitting component comprising a light-emitting semiconductor chip, a transparent conductive layer, and at least two electrical connection points, wherein the transparent conductive layer covers the light-emitting semiconductor chip at least in places, and the electrical connection points are arranged on a side of the light-emitting semiconductor chip facing away from the transparent conductive layer.

公开(公告)号：US20240313155A1

公开(公告)日：2024-09-19

申请号：US18182393

申请日：2023-03-13

申请人： MIKRO MESA TECHNOLOGY CO., LTD.

发明人： Li-Yi CHEN ,  Hsin-Wei LEE

IPC分类号： H01L33/02 ,  H01L33/32 ,  H01L33/40 ,  H01L33/52 ,  H01L33/58

CPC分类号： H01L33/025 ,  H01L33/325 ,  H01L33/405 ,  H01L33/52 ,  H01L33/58 ,  H01L27/156

摘要： A micro light-emitting diode device includes a substrate, a micro light-emitting diode, and a transparent top electrode. The micro light-emitting diode is disposed on the substrate and includes a p-type GaN layer, an n-type GaN layer above the p-type GaN layer, an n-doped InxAl(1-x)N layer above and in contact with the n-type GaN layer, and an active layer between the p-type GaN layer and the n-type GaN layer. x is a positive number smaller than 0.5. The transparent top electrode covers and is in contact with the n-doped InxAl(1-x)N layer. A refractive index of the n-doped InxAl(1-x)N layer is smaller than a refractive index of the n-type GaN layer. A sum of the thicknesses of the n-type GaN layer and the n-doped InxAl(1-x)N layer is greater than a sum of the thicknesses of the active layer and the p-type GaN layer.

公开(公告)号：US20240313154A1

公开(公告)日：2024-09-19

申请号：US18182390

申请日：2023-03-13

申请人： MIKRO MESA TECHNOLOGY CO., LTD.

发明人： Li-Yi CHEN ,  Hsin-Wei LEE

IPC分类号： H01L33/02 ,  H01L33/32 ,  H01L33/42 ,  H01L33/52 ,  H01L33/58

CPC分类号： H01L33/025 ,  H01L33/32 ,  H01L33/42 ,  H01L33/52 ,  H01L33/58 ,  H01L27/156

摘要： A micro light-emitting diode device includes a substrate, a micro light-emitting diode, and a cathode transparent electrode. The micro light-emitting diode is disposed on the substrate and includes a p-type III-nitride layer, a first n-type III-nitride layer above the p-type III-nitride layer, a second n-type III-nitride layer above the first n-type III-nitride layer, and an active layer between the p-type and first n-type III-nitride layers. The second n-type III-nitride layer contains aluminum and has top and bottom surfaces. A refractive index of the second n-type III-nitride layer is smaller than a refractive index of the first n-type III-nitride layer and varies in a monotonically non-decreasing manner from the top surface. The refractive index of the second n-type III-nitride layer is larger at the bottom surface than at the top surface. The cathode transparent electrode is in contact with the top surface.

公开(公告)号：US20240258289A1

公开(公告)日：2024-08-01

申请号：US17927609

申请日：2021-11-02

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Hong ZHU ,  Lu LIU

IPC分类号： H01L25/16 ,  H01L27/15 ,  H01L33/52 ,  H01L33/58

CPC分类号： H01L25/167 ,  H01L27/156 ,  H01L33/52 ,  H01L33/58

摘要： A flexible display panel has a display area, a bezel area disposed around the display area and a sliding and rolling connection area connected to a first border of the bezel area away from the display area. The flexible display panel includes a base substrate covering at least the display area and the bezel area and one or more inorganic insulating layers located on a side of the base substrate. A total thickness of a portion of the one or more inorganic insulating layers located in the sliding and rolling connection area is less than a total thickness of a portion of the one or more inorganic insulating layers located in the display area.

公开(公告)号：US20240258184A1

公开(公告)日：2024-08-01

申请号：US18630676

申请日：2024-04-09

申请人： STMicroelectronics (Grenoble 2) SAS

发明人： Jerome LOPEZ

IPC分类号： H01L23/31 ,  H01L23/10 ,  H01L23/12 ,  H01L33/52

CPC分类号： H01L23/3114 ,  H01L23/10 ,  H01L23/12 ,  H01L33/52

摘要： An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.

公开(公告)号：US12051363B2

公开(公告)日：2024-07-30

申请号：US18210061

申请日：2023-06-14

申请人： Lumileds LLC

发明人： Brendan Jude Moran

IPC分类号： G09G3/32 ,  B60K35/00 ,  B60K35/22 ,  G06F3/01 ,  G06F3/041 ,  G06F3/14 ,  G09G3/00 ,  G09G3/20 ,  H01L25/075 ,  H01L25/16 ,  H01L33/52 ,  H04N23/53

CPC分类号： G09G3/32 ,  B60K35/00 ,  G06F3/011 ,  G06F3/0412 ,  G06F3/1446 ,  G09G3/035 ,  G09G3/2003 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H04N23/53 ,  B60K35/22 ,  B60K2360/332 ,  G09G2300/02 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2300/0491 ,  G09G2320/0233 ,  G09G2320/028 ,  G09G2320/0626 ,  G09G2320/066 ,  G09G2320/068 ,  G09G2354/00 ,  G09G2370/06 ,  G09G2380/02 ,  G09G2380/10

摘要： A display that contains a sparse array of light-emitting diodes (LEDs), system, and method of fabrication are disclosed. The display includes a panel having at least one tile configured to display information. The panel is disposed within or on a transparent material. Each tile includes an array of LEDs, which have a uniform distance therebetween such that light from the array is viewable on opposing sides of the panel while providing visibility through the panel. A darkening layer on at least one side of the panel provides selectable darkening to block the light from exiting the at least one side of the panel.

公开(公告)号：US20240250221A1

公开(公告)日：2024-07-25

申请号：US18607571

申请日：2024-03-18

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ming-Fa Chen ,  Hsien-Wei Chen ,  Jie Chen

IPC分类号： H01L33/52 ,  G02B6/12 ,  G02B6/42 ,  H01L25/16 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62

CPC分类号： H01L33/52 ,  G02B6/12004 ,  G02B6/4206 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0058

摘要： A manufacturing method of a semiconductor package includes the following steps. A photonic die is provided, wherein the photonic die includes an optical coupler. An electronic die is bonded over the photonic die. An encapsulating material is provided over the photonic die, wherein the encapsulating material at least laterally encapsulates the electronic die. A substrate is bonded over the encapsulated electronic die. A lens structure is formed over the photonic die, wherein the lens structure is overlapped with the optical coupler from a top view.

公开(公告)号：US12040435B2

公开(公告)日：2024-07-16

申请号：US17283533

申请日：2019-09-26

申请人： SONY CORPORATION

发明人： Takahiro Koyama ,  Toyoharu Oohata

IPC分类号： H01L33/60 ,  H01L25/075 ,  H01L33/52

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/52

摘要： Provided is a light-emitting device that includes a solid-state light source emitting excitation light and a phosphor layer having a first refractive index, provided on a light-emitting surface side of the solid-state light source, and having a first reflection film on its side surface. The light-emitting device further includes a low refractive layer provided on the phosphor layer and having a second refractive index less than the first refractive index, and a sealing member encapsulating the phosphor layer and the low refractive layer and having a third refractive index greater than or equal to the second refractive index.