公开(公告)号：US20130175369A1

公开(公告)日：2013-07-11

申请号：US13718706

申请日：2012-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun-yong PARK ,  Ho-moon LEE ,  Choo-ho KIM

IPC: B05B1/30

CPC classification number: B05B1/304 ,  B05B1/3046 ,  B05B15/18

Abstract: A phosphor dispenser includes: a nozzle having a space for accommodating the phosphor liquid, wherein an opening for ejecting the phosphor liquid is connected to the space; and a tappet reciprocally movable with respect to the nozzle to eject the phosphor liquid in the space through the nozzle, wherein the tappet includes a cylindrical unit having a cylindrical shape and a convex unit having a hemispherical shape that is convex towards the nozzle from the cylindrical unit, and the convex unit is formed of polycrystalline diamond (PCD).

Abstract translation: 荧光体分配器包括：具有用于容纳荧光体液体的空间的喷嘴，其中用于喷射荧光体液体的开口连接到该空间; 以及相对于所述喷嘴可往复移动的挺杆，以通过所述喷嘴将所述荧光体液体喷射到所述空间中，其中所述挺杆包括具有圆柱形状的圆柱形单元和具有半圆形形状的凸起单元，所述凸形单元从所述圆柱体朝向所述喷嘴凸起 单元，并且凸单元由多晶金刚石（PCD）形成。

公开(公告)号：US20130183836A1

公开(公告)日：2013-07-18

申请号：US13693795

申请日：2012-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eui-seok KIM ,  Sang-kyu BANG ,  Soo-hyun CHO ,  Choo-ho KIM ,  Won-soo JI

IPC: H01L21/263

CPC classification number: H01L21/2633 ,  H01L21/76898 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods of forming through-silicon vias by using laser ablation. A method includes, laser drilling to form a plurality of grooves by irradiating a laser beam onto an upper surface of a silicon wafer, and grinding a lower surface of the silicon wafer to form a plurality of through-silicon vias by exposing the grooves on the lower surface of the silicon wafer.

Abstract translation: 通过使用激光烧蚀形成穿硅通孔的方法。 一种方法包括：激光钻孔以通过将激光束照射到硅晶片的上表面上来形成多个凹槽，以及研磨硅晶片的下表面以形成多个穿硅通孔，以通过使 硅晶片的下表面。

公开(公告)号：US20170125647A1

公开(公告)日：2017-05-04

申请号：US15216137

申请日：2016-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： HUN-YONG PARK ,  Choo-ho KIM ,  Song-ho JEONG ,  Jong-ho LIM

IPC: H01L33/50 ,  H01L33/30 ,  H01L33/38

CPC classification number: H01L33/505 ,  H01L33/30 ,  H01L33/382 ,  H01L33/486 ,  H01L33/504 ,  H01L33/56 ,  H01L2933/0041

Abstract: A light-emitting diode (LED) package includes an LED chip, a phosphor film adhered to a top surface of the LED chip, and a molding phosphor covering a side surface of the LED chip.

公开(公告)号：US20130307003A1

公开(公告)日：2013-11-21

申请号：US13709302

申请日：2012-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hun-yong PARK ,  Choo-ho KIM ,  Won-ho JUNG ,  Jin-ki HONG

IPC: H01L33/46

CPC classification number: H01L33/46 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.

Abstract translation: 发光器件封装可以包括预模具和模制构件。 预模具可以包括具有倾斜（例如，凹入）平面的上体，通过该平面形成穿过上体的多个垂直孔，下体具有与倾斜（例如，凹）面相交的上表面 在上身下形成一个凹面单元。 成型构件可以填充多个垂直孔和凹形单元。

公开(公告)号：US20130193131A1

公开(公告)日：2013-08-01

申请号：US13706146

申请日：2012-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-hoe HUR ,  Dong-myung SHIN ,  Jong-pa HONG ,  Choo-ho KIM ,  Won-soo JI ,  Jun-woo KIM

IPC: G01J5/00 ,  H05B1/00

CPC classification number: G01J5/00 ,  G01J5/0007 ,  G01J5/029 ,  G01J5/048 ,  G01J5/0818 ,  H05B1/00

Abstract: An optical pyrometer includes a receiving part having a receiving end for receiving light radiation of a heating unit, and a case part covering the receiving part, except for the receiving end of the receiving part, wherein a cross-sectional area of the receiving end of the receiving part perpendicular to a lengthwise direction of the receiving end of the receiving part decreases toward an end portion of the receiving end of the receiving part.

Abstract translation: 光学高温计包括具有用于接收加热单元的光辐射的接收端的接收部分和覆盖接收部分的外壳部分，除了接收部分的接收端之外，其中接收端的接收端的横截面积 与接收部的接收端的长度方向垂直的接收部朝向接收部的接收端的端部而减小。

公开(公告)号：US20130168726A1

公开(公告)日：2013-07-04

申请号：US13677109

申请日：2012-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun-yong PARK ,  Dae-young KIM ,  Choo-ho KIM ,  Jomg-o LIM ,  Yong-rak JEONG

IPC: B29C45/14 ,  H01L33/52

CPC classification number: B29C45/14819 ,  B29C45/14655 ,  B29C45/2708 ,  B29C45/34 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device package mold and a method of manufacturing a lens of a light-emitting device package. The light-emitting device package mold includes a convex unit, an inner circumference of which has a hemispherical shape; a flat panel unit that forms a flat panel by extending from an edge of the convex unit; a cylindrical unit extending in a vertical direction with respect to an upper surface of the flat panel unit; and an injection hole and a discharge hole that penetrate through the convex unit, wherein the discharge hole is formed in a horizontal direction with respect to the flat panel unit.

Abstract translation: 发光器件封装模具和制造发光器件封装的透镜的方法。 发光装置封装模具包括：其内周具有半球形状的凸部; 平板组件，其通过从所述凸单元的边缘延伸而形成平板; 圆筒形单元，其相对于所述平板单元的上表面在垂直方向上延伸; 以及贯通凸部的注入孔和排出孔，其中，排出孔相对于平板单元在水平方向上形成。