公开(公告)号：US20180224481A1

公开(公告)日：2018-08-09

申请号：US15832762

申请日：2017-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyu Yeol KIM ,  Yu Kyum KIM ,  Jae Won KIM

IPC: G01R1/073

CPC classification number: G01R1/07371 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2891

Abstract: A probe card assembly is provided as follows. A tile fixing substrate is disposed on a printed circuit board. A plurality of ceramic tiles is detachably attached to the tile fixing substrate. Each of the plurality of ceramic tiles comprises a plurality of probes. A plurality of alignment marks is fixed to the tile fixing substrate.