公开(公告)号：US20200304631A1

公开(公告)日：2020-09-24

申请号：US16645229

申请日：2018-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong Hoon KIM ,  Jong Kyoung LIM ,  Jae Won KIM ,  Jae In YOO ,  Hyun Woo LEE ,  Jong Eun YANG

IPC: H04M3/42 ,  H04M1/725

Abstract: An electronic device of the present disclosure may: transmit identification information corresponding to a call counterpart to an external server, using a communication circuit; receive state information of the call counterpart from the external server as a response to the transmission of the identification information; and display the state information of the call counterpart, in one area of a user interface of an application.

公开(公告)号：US20200234584A1

公开(公告)日：2020-07-23

申请号：US16648477

申请日：2018-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun Hee YOUM ,  Jae Won KIM ,  Beom Seok OH

IPC: G08G1/0967 ,  H04W4/021 ,  H04W4/38 ,  H04W4/44 ,  G01C21/28 ,  G01W1/02 ,  B60S1/08 ,  G07C5/00

Abstract: Disclosed are a system, a server, and a method for information provision. A method for information provision includes receiving, from a terminal device of a vehicle, sensing information and location information detected by the terminal device of the vehicle, generating present environment condition information by regions by using the received sensing information and location information, and based on a service request being received from the terminal device of the vehicle, transmitting the environment condition information to the terminal device of the vehicle. Accordingly, a server may provide, on a real-time basis, environment condition information related to weather using sensing information detected by a terminal device of a vehicle.

公开(公告)号：US20180224481A1

公开(公告)日：2018-08-09

申请号：US15832762

申请日：2017-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyu Yeol KIM ,  Yu Kyum KIM ,  Jae Won KIM

IPC: G01R1/073

CPC classification number: G01R1/07371 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2891

Abstract: A probe card assembly is provided as follows. A tile fixing substrate is disposed on a printed circuit board. A plurality of ceramic tiles is detachably attached to the tile fixing substrate. Each of the plurality of ceramic tiles comprises a plurality of probes. A plurality of alignment marks is fixed to the tile fixing substrate.