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    STORAGE DEVICES FOR POWER OPTIMIZATION, STORAGE SYSTEMS INCLUDING THE SAME, AND OPERATING METHODS THEREOF
    1.
    发明公开
    STORAGE DEVICES FOR POWER OPTIMIZATION, STORAGE SYSTEMS INCLUDING THE SAME, AND OPERATING METHODS THEREOF 审中-公开

    公开(公告)号：US20240029764A1

    公开(公告)日：2024-01-25

    申请号：US18133566

    申请日：2023-04-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chanwoo Park ,  Yu-Sung Kim

    IPC: G11C5/14

    CPC classification number: G11C5/14

    Abstract: A storage device which includes a non-volatile memory, a storage controller that is connected with the non-volatile memory and is configured to calculate a real-time power value of the storage device through at least one current value and at least one voltage value received from an ADC module, and to generate a clock control signal based on the real-time power value. The ADC module may be connected with at least one line that supplies a power to the storage device, and the ADC module may measure the at least one current value and the at least one voltage value. The storage device may include a clock adjustment unit that adjusts a plurality of clock signals used to drive the storage controller based on the clock control signal and sends the plurality of clock signals to the storage controller.

    Semiconductor support frame and storage device having the same
    3.
    发明授权
    Semiconductor support frame and storage device having the same 有权

    公开(公告)号：US10306779B2

    公开(公告)日：2019-05-28

    申请号：US15285261

    申请日：2016-10-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yu-Sung Kim ,  Ji-Yong Kim ,  Chung-Hyun Ryu

    IPC: H05K5/00 ,  H05K1/14 ,  G11C5/04

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

    SEMICONDUCTOR SUPPORT FRAME AND STORAGE DEVICE HAVING THE SAME
    5.
    发明申请
    SEMICONDUCTOR SUPPORT FRAME AND STORAGE DEVICE HAVING THE SAME 审中-公开

    公开(公告)号：US20170105290A1

    公开(公告)日：2017-04-13

    申请号：US15285261

    申请日：2016-10-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yu-Sung Kim ,  Ji-Yong Kim ,  Chung-Hyun Ryu

    IPC: H05K5/00 ,  H05K1/14 ,  G11C5/04 ,  H05K1/18

    CPC classification number: H05K5/0008 ,  G11C5/04 ,  H05K1/148 ,  H05K5/0026 ,  H05K2201/056 ,  H05K2201/10424

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

    Memory card
    6.
    发明授权
    Memory card 有权

    公开(公告)号：US09620875B2

    公开(公告)日：2017-04-11

    申请号：US14804316

    申请日：2015-07-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yu-Sung Kim ,  Jin-Hyuk Lee ,  Il-Mok Kang ,  Seok-Jae Han

    IPC: G06K19/06 ,  H05K1/14 ,  H01R12/72 ,  H01R13/64

    CPC classification number: H01R12/721 ,  H01R13/64

    Abstract: A memory card, comprising: a top surface; a bottom surface on an opposite side of the memory card from the top surface; and a first alignment structure formed on the top surface or the bottom surface and configured to interface with a corresponding second alignment structure of a memory card socket when the memory card is correctly inserted into the memory card socket and configured to substantially prevent full insertion of the memory card when the memory card is incorrectly inserted into the memory card socket.

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