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    STORAGE DEVICES FOR POWER OPTIMIZATION, STORAGE SYSTEMS INCLUDING THE SAME, AND OPERATING METHODS THEREOF
    1.
    发明公开
    STORAGE DEVICES FOR POWER OPTIMIZATION, STORAGE SYSTEMS INCLUDING THE SAME, AND OPERATING METHODS THEREOF 审中-公开

    公开(公告)号：US20240029764A1

    公开(公告)日：2024-01-25

    申请号：US18133566

    申请日：2023-04-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chanwoo Park ,  Yu-Sung Kim

    IPC: G11C5/14

    CPC classification number: G11C5/14

    Abstract: A storage device which includes a non-volatile memory, a storage controller that is connected with the non-volatile memory and is configured to calculate a real-time power value of the storage device through at least one current value and at least one voltage value received from an ADC module, and to generate a clock control signal based on the real-time power value. The ADC module may be connected with at least one line that supplies a power to the storage device, and the ADC module may measure the at least one current value and the at least one voltage value. The storage device may include a clock adjustment unit that adjusts a plurality of clock signals used to drive the storage controller based on the clock control signal and sends the plurality of clock signals to the storage controller.

    ESTIMATING HEIGHTS OF DEFECTS IN A WAFER
    2.
    发明申请
    ESTIMATING HEIGHTS OF DEFECTS IN A WAFER 有权

    公开(公告)号：US20220189806A1

    公开(公告)日：2022-06-16

    申请号：US17190885

    申请日：2021-03-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Shashank Shrikant Agashe ,  Gaurav Kumar ,  Sathyanarayanan Kulasekaran ,  Chanwoo Park ,  Yunje Cho

    IPC: H01L21/67 ,  G06T17/00 ,  G06T19/20 ,  G06T7/00 ,  G01N23/2251

    Abstract: The present disclosure relates to a method for estimating heights of defects in a wafer. The method comprises creating an un-calibrated 3D model of a defect in a wafer, determining one or more attributes associated with the un-calibrated 3D model, transforming the un-calibrated 3D model to a calibrated 3D model, and estimating a height of the defect using the calibrated 3D model. Creating an un-calibrated 3D model corresponds to a defect present in a wafer based on a plurality of Scanning Electron Microscope (SEM) images of the defect. Transforming the un-calibrated 3D model to a calibrated 3D model uses a scaling factor corresponding to the determined one or more attributes associated with the un-calibrated 3D model. A height of the defect is estimated based on the calibrated 3D model of the defect.

    Method of recognizing situation requiring translation and performing translation function, and electronic device implementing the same
    4.
    发明授权
    Method of recognizing situation requiring translation and performing translation function, and electronic device implementing the same 有权
    识别需要翻译和执行翻译功能的情况的方法，以及执行翻译功能的电子设备

    公开(公告)号：US09460090B2

    公开(公告)日：2016-10-04

    申请号：US14448297

    申请日：2014-07-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinwoo Lee ,  Chanwoo Park ,  Byungsoo Kim ,  Jiyeon Seo ,  Myunghwan Lee

    IPC: G06F17/28

    CPC classification number: G06F17/289

    Abstract: Disclosed are a method of recognizing a translation situation and performing a translation function, and an electronic device implementing the same. The electronic device recognizes a situation involving translation and automatically performs a translation function, thereby improving user convenience. An electronic device includes an audio module configured to receive and output audio signal, and a processor. A language translation program is executed in response to detecting that an audio signal received through the audio module includes at least a first language and a second language, a portion of the audio signal that is in the second language is translated into the first language, and the translated portion is outputted through the audio module.

    Abstract translation: 公开了一种识别翻译情况和执行翻译功能的方法，以及实现该翻译功能的电子设备。 电子设备识别涉及翻译的情况并自动执行翻译功能，从而提高用户便利性。 电子设备包括被配置为接收和输出音频信号的音频模块以及处理器。 响应于检测到通过音频模块接收的音频信号至少包括第一语言和第二语言，执行语言翻译程序，将处于第二语言的音频信号的一部分转换为第一语言，以及 翻译部分通过音频模块输出。

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