Read-out circuits of image sensors and image sensors including the same

    公开(公告)号:US10334193B2

    公开(公告)日:2019-06-25

    申请号:US15415273

    申请日:2017-01-25

    Abstract: A read-out circuit of an image sensor includes a ramp signal generator, a bias voltage generator and a conversion circuit. The ramp signal generates a ramp signal that linearly varies at a constant slope. The bias voltage generator generates a bias voltage based on a power supply voltage having a first noise component. The conversion circuit generates a reference voltage based on the bias voltage and the ramp signal, and performs an analog-to-digital conversion on an analog signal from a pixel to generate a digital signal corresponding to the analog signal. The analog signal has second noise component. The bias voltage generator adjusts an alternating current component included in the bias voltage such that a magnitude of a third noise component added to the reference voltage is substantially the same as a magnitude of the second noise component.

    SEMICONDUCTOR SUPPORT FRAME AND STORAGE DEVICE HAVING THE SAME

    公开(公告)号:US20170105290A1

    公开(公告)日:2017-04-13

    申请号:US15285261

    申请日:2016-10-04

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

    Semiconductor support frame and storage device having the same

    公开(公告)号:US10306779B2

    公开(公告)日:2019-05-28

    申请号:US15285261

    申请日:2016-10-04

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

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