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    Read-out circuits of image sensors and image sensors including the same
    1.
    发明授权
    Read-out circuits of image sensors and image sensors including the same 有权

    公开(公告)号：US10334193B2

    公开(公告)日：2019-06-25

    申请号：US15415273

    申请日：2017-01-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyu-Ik Cho ,  Ji-Yong Kim ,  Jae-Jung Park

    IPC: H04N5/369 ,  H04N5/357 ,  H04N5/378 ,  H03K4/50 ,  H04N5/3745

    Abstract: A read-out circuit of an image sensor includes a ramp signal generator, a bias voltage generator and a conversion circuit. The ramp signal generates a ramp signal that linearly varies at a constant slope. The bias voltage generator generates a bias voltage based on a power supply voltage having a first noise component. The conversion circuit generates a reference voltage based on the bias voltage and the ramp signal, and performs an analog-to-digital conversion on an analog signal from a pixel to generate a digital signal corresponding to the analog signal. The analog signal has second noise component. The bias voltage generator adjusts an alternating current component included in the bias voltage such that a magnitude of a third noise component added to the reference voltage is substantially the same as a magnitude of the second noise component.

    SEMICONDUCTOR SUPPORT FRAME AND STORAGE DEVICE HAVING THE SAME
    2.
    发明申请
    SEMICONDUCTOR SUPPORT FRAME AND STORAGE DEVICE HAVING THE SAME 审中-公开

    公开(公告)号：US20170105290A1

    公开(公告)日：2017-04-13

    申请号：US15285261

    申请日：2016-10-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yu-Sung Kim ,  Ji-Yong Kim ,  Chung-Hyun Ryu

    IPC: H05K5/00 ,  H05K1/14 ,  G11C5/04 ,  H05K1/18

    CPC classification number: H05K5/0008 ,  G11C5/04 ,  H05K1/148 ,  H05K5/0026 ,  H05K2201/056 ,  H05K2201/10424

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

    Semiconductor support frame and storage device having the same
    4.
    发明授权
    Semiconductor support frame and storage device having the same 有权

    公开(公告)号：US10306779B2

    公开(公告)日：2019-05-28

    申请号：US15285261

    申请日：2016-10-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yu-Sung Kim ,  Ji-Yong Kim ,  Chung-Hyun Ryu

    IPC: H05K5/00 ,  H05K1/14 ,  G11C5/04

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

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