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公开(公告)号:US10334193B2
公开(公告)日:2019-06-25
申请号:US15415273
申请日:2017-01-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyu-Ik Cho , Ji-Yong Kim , Jae-Jung Park
IPC: H04N5/369 , H04N5/357 , H04N5/378 , H03K4/50 , H04N5/3745
Abstract: A read-out circuit of an image sensor includes a ramp signal generator, a bias voltage generator and a conversion circuit. The ramp signal generates a ramp signal that linearly varies at a constant slope. The bias voltage generator generates a bias voltage based on a power supply voltage having a first noise component. The conversion circuit generates a reference voltage based on the bias voltage and the ramp signal, and performs an analog-to-digital conversion on an analog signal from a pixel to generate a digital signal corresponding to the analog signal. The analog signal has second noise component. The bias voltage generator adjusts an alternating current component included in the bias voltage such that a magnitude of a third noise component added to the reference voltage is substantially the same as a magnitude of the second noise component.
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公开(公告)号:US20170105290A1
公开(公告)日:2017-04-13
申请号:US15285261
申请日:2016-10-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yu-Sung Kim , Ji-Yong Kim , Chung-Hyun Ryu
CPC classification number: H05K5/0008 , G11C5/04 , H05K1/148 , H05K5/0026 , H05K2201/056 , H05K2201/10424
Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.
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公开(公告)号:US20170105314A1
公开(公告)日:2017-04-13
申请号:US15229766
申请日:2016-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ji-Yong Kim , Yu-Sung Kim , Chung-Hyun Ryu , Sung-Ki Lee
CPC classification number: H05K7/20409 , F28D21/00 , F28D2021/0029 , F28F3/04 , F28F27/00 , F28F2215/04 , H05K7/20509
Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
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公开(公告)号:US10306779B2
公开(公告)日:2019-05-28
申请号:US15285261
申请日:2016-10-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yu-Sung Kim , Ji-Yong Kim , Chung-Hyun Ryu
Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.
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公开(公告)号:US09894805B2
公开(公告)日:2018-02-13
申请号:US15229766
申请日:2016-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ji-Yong Kim , Yu-Sung Kim , Chung-Hyun Ryu , Sung-Ki Lee
IPC: H05K7/20 , F28D21/00 , F28F3/04 , F28F27/00 , H01L23/473
CPC classification number: H05K7/20409 , F28D21/00 , F28D2021/0029 , F28F3/04 , F28F27/00 , F28F2215/04 , H05K7/20509
Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
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