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1.发明申请公开(公告)号：US20190381629A1
公开(公告)日：2019-12-19
申请号：US16434853
申请日：2019-06-07
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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2.发明申请公开(公告)号：US20220234166A1
公开(公告)日：2022-07-28
申请号：US17720847
申请日：2022-04-14
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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Patent Agency Ranking
3.发明授权公开(公告)号：US11691242B2
公开(公告)日：2023-07-04
申请号：US17720847
申请日：2022-04-14
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
CPC classification number: B24B37/048 , G11B5/3169
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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4.发明授权公开(公告)号：US11305397B2
公开(公告)日：2022-04-19
申请号：US16430540
申请日：2019-06-04
Applicant: Seagate Technology LLC
Inventor： Andrew Habermas , Dat Quach , Jeff O'Konski , Yuhong Xiong , Ricky Anderson , Joshua Zierhut
IPC: B24B37/015 , B24B37/04 , G11B5/31 , G11B5/60 , B24B37/10
Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5° C., or even +/−0.5° C.
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5.发明公开公开(公告)号：US20230311268A1
公开(公告)日：2023-10-05
申请号：US18199526
申请日：2023-05-19
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
CPC classification number: B24B37/048 , G11B5/3169
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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公开(公告)号：US11037586B1
公开(公告)日：2021-06-15
申请号：US16380056
申请日：2019-04-10
Applicant: Seagate Technology LLC
Inventor： Andrew Sherve , Jeff O'Konski , Yuhong Xiong , Andrew Habermas
Abstract: The present disclosure includes methods and systems for lapping a row bar of sliders. According to the present disclosure, an electrical interconnect configuration is provided that permits the net current provided to a row bar to heat electrical heating devices during lapping to be managed so as help prevent exceeding breakdown currents of related electrical channels.
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7.发明申请公开(公告)号：US20190381628A1
公开(公告)日：2019-12-19
申请号：US16430540
申请日：2019-06-04
Applicant: Seagate Technology LLC
Inventor： Andrew Habermas , Dat Quach , Jeff O'Konski , Yuhong Xiong , Ricky Anderson , Joshua Zierhut
Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5° C., or even +/−5° C.
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