公开(公告)号：US11749300B2

公开(公告)日：2023-09-05

申请号：US16661564

申请日：2019-10-23

Applicant: Seagate Technology LLC

Inventor： Zubair Ahmed Khan ,  Dat Quach ,  Andrew Habermas ,  Joel William Hoehn

IPC: G11B5/31 ,  C09J175/04 ,  C09J133/10 ,  H01L21/683 ,  H01L21/304 ,  C09J7/38 ,  B24B37/04 ,  C09J175/08

CPC classification number: G11B5/3169 ,  B24B37/048 ,  C09J7/38 ,  C09J133/10 ,  C09J175/04 ,  H01L21/304 ,  H01L21/6836 ,  C08G2170/40 ,  C09J175/08 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2475/00 ,  H01L2221/68327

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

公开(公告)号：US11305397B2

公开(公告)日：2022-04-19

申请号：US16430540

申请日：2019-06-04

Applicant: Seagate Technology LLC

Inventor： Andrew Habermas ,  Dat Quach ,  Jeff O'Konski ,  Yuhong Xiong ,  Ricky Anderson ,  Joshua Zierhut

IPC: B24B37/015 ,  B24B37/04 ,  G11B5/31 ,  G11B5/60 ,  B24B37/10

Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5° C., or even +/−0.5° C.

公开(公告)号：US20190381628A1

公开(公告)日：2019-12-19

申请号：US16430540

申请日：2019-06-04

Applicant: Seagate Technology LLC

Inventor： Andrew Habermas ,  Dat Quach ,  Jeff O'Konski ,  Yuhong Xiong ,  Ricky Anderson ,  Joshua Zierhut

IPC: B24B37/04 ,  G11B5/60 ,  G11B5/31

Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5° C., or even +/−5° C.

公开(公告)号：US20230360672A1

公开(公告)日：2023-11-09

申请号：US18224910

申请日：2023-07-21

Applicant: Seagate Technology LLC

Inventor： Zubair Ahmed Khan ,  Dat Quach ,  Andrew Habermas ,  Joel William Hoehn

IPC: G11B5/31 ,  C09J175/04 ,  C09J133/10 ,  H01L21/683 ,  H01L21/304 ,  C09J7/38 ,  B24B37/04

CPC classification number: G11B5/3169 ,  C09J175/04 ,  C09J133/10 ,  H01L21/6836 ,  H01L21/304 ,  C09J7/38 ,  B24B37/048 ,  H01L2221/68327 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2475/00 ,  C08G2170/40 ,  C09J175/08

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

公开(公告)号：US20200090687A1

公开(公告)日：2020-03-19

申请号：US16661564

申请日：2019-10-23

Applicant: Seagate Technology LLC

Inventor： Zubair Ahmed Khan ,  Dat Quach ,  Andrew Habermas ,  Joel William Hoehn

IPC: G11B5/31 ,  B24B37/04 ,  C09J133/10 ,  C09J7/38 ,  H01L21/683

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

公开(公告)号：US10465099B1

公开(公告)日：2019-11-05

申请号：US15799264

申请日：2017-10-31

Applicant: Seagate Technology LLC

Inventor： Zubair Ahmed Khan ,  Dat Quach ,  Andrew Habermas ,  Joel William Hoehn

IPC: C09J175/04 ,  C09J7/02 ,  C09J133/10 ,  H01L21/683 ,  H01L21/304

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.