公开(公告)号：US20210175447A1

公开(公告)日：2021-06-10

申请号：US17177457

申请日：2021-02-17

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu OHNO ,  Kayo KUMAKURA ,  Hiroyuki WATANABE ,  Seiji YASUMOTO ,  Satoru IDOJIRI ,  Hiroki ADACHI

IPC: H01L51/00 ,  H01L51/52 ,  H01L27/32 ,  H01L27/12 ,  H01L29/786

Abstract: The yield of a separation process is improved. The mass productivity of a display device which is formed through a separation process is improved. A layer is formed over a substrate with use of a material including a resin or a resin precursor. Next, a resin layer is formed by performing heat treatment on the layer. Next, a layer to be separated is formed over the resin layer. Then, the layer to be separated and the substrate are separated from each other. The heat treatment is performed in an atmosphere containing oxygen or while supplying a gas containing oxygen.

公开(公告)号：US20200235323A1

公开(公告)日：2020-07-23

申请号：US16842820

申请日：2020-04-08

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu OHNO ,  Kayo KUMAKURA ,  Hiroyuki WATANABE ,  Seiji YASUMOTO ,  Satoru IDOJIRI ,  Hiroki ADACHI

IPC: H01L51/00 ,  H01L27/12 ,  H01L27/32 ,  H01L51/52

Abstract: The yield of a separation process is improved. The mass productivity of a display device which is formed through a separation process is improved. A layer is formed over a substrate with use of a material including a resin or a resin precursor. Next, a resin layer is formed by performing heat treatment on the layer. Next, a layer to be separated is formed over the resin layer. Then, the layer to be separated and the substrate are separated from each other. The heat treatment is performed in an atmosphere containing oxygen or while supplying a gas containing oxygen.

公开(公告)号：US20180033978A1

公开(公告)日：2018-02-01

申请号：US15657259

申请日：2017-07-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu OHNO ,  Kayo KUMAKURA ,  Hiroyuki WATANABE ,  Seiji YASUMOTO ,  Satoru IDOJIRI ,  Hiroki ADACHI

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/52

CPC classification number: H01L51/0097 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/3262 ,  H01L29/7869 ,  H01L51/003 ,  H01L51/5246 ,  H01L51/5253 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  Y02E10/549

Abstract: The yield of a separation process is improved. The mass productivity of a display device which is formed through a separation process is improved. A layer is formed over a substrate with use of a material including a resin or a resin precursor. Next, a resin layer is formed by performing heat treatment on the layer. Next, a layer to be separated is formed over the resin layer. Then, the layer to be separated and the substrate are separated from each other. The heat treatment is performed in an atmosphere containing oxygen or while supplying a gas containing oxygen.