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公开(公告)号：US12107101B2
公开(公告)日：2024-10-01
申请号：US17546740
申请日：2021-12-09
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Zhenyu Jia
IPC: H01L27/146 , H01L25/16
CPC classification number: H01L27/14618 , H01L25/167 , H01L27/1462 , H01L27/14627 , H01L27/14636
Abstract: The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.
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公开(公告)号：US11791553B2
公开(公告)日：2023-10-17
申请号：US17425572
申请日：2020-08-24
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Qinyi Duan , Qiongqin Mao
CPC classification number: H01Q3/36
Abstract: A phase shifter, a fabrication method thereof, and an antenna are provided. The phase shifter includes a first substrate, a second substrate, a ground electrode disposed on a side of the first substrate facing towards the second substrate, a transmission electrode disposed on a side of the second substrate facing towards the first substrate, and liquid crystals filled between the first substrate and the second substrate. In a direction perpendicular to a plane of the second substrate, the transmission electrode overlaps with the ground electrode. The ground electrode is provided with a detection hollow part, and in the direction perpendicular to the plane of the second substrate, at least a part of the detection hollow part does not overlap with the transmission electrode.
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公开(公告)号：US11670852B2
公开(公告)日：2023-06-06
申请号：US17574344
申请日：2022-01-12
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Dengming Lei , Kerui Xi , Zhenyu Jia , Ping Su , Huihui Jiang , Yi Wang , Wei Li , Huan Li , Feng Qin
IPC: H01Q3/36
CPC classification number: H01Q3/36
Abstract: A scanning antenna is provided in the present disclosure. The scanning antenna includes a first substrate and a second substrate which are arranged oppositely; a liquid crystal layer between the first substrate and the second substrate; and a feed signal access terminal and a plurality of phase shift units, where the plurality of phase shift units is connected with each other, each phase shift unit is connected to the feed signal access terminal, and electrical lengths between at least two phase shift units and the feed signal access terminal are different. The present disclosure not only realizes one-dimensional wave beam scanning, but also has desirable scanning effect. The bias voltage is not needed to be independently applied to each phase shift unit, which can greatly simplify the bias voltage line configuration and be beneficial for reducing production cost and wiring difficulty.
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4.发明授权公开(公告)号：US11581196B2
公开(公告)日：2023-02-14
申请号：US16913020
申请日：2020-06-26
Inventor： Xuhui Peng , Kerui Xi , Tingting Cui , Feng Qin , Jie Zhang
IPC: H01L21/48 , H01L21/56 , H01L23/498 , H01L23/00
Abstract: A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.
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公开(公告)号：US12226771B2
公开(公告)日：2025-02-18
申请号：US17455148
申请日：2021-11-16
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Kaidi Zhang , Baiquan Lin , Wei Li , Yunfei Bai , Kerui Xi , Feng Qin
Abstract: A driving circuit, a driving method and a microfluidic substrate are provided. The driving circuit includes a first switching unit, a second switching unit, a reset unit, a first capacitor, and a second capacitor. In a first stage of a driving process of the driving circuit, the first switching unit is turned on, a first voltage signal is transmitted to a first node, the second switching unit is turned on, a second voltage signal is input to an output terminal of the driving circuit, and the driving circuit outputs an AC signal. In a second stage of the driving process, the first switching unit is turned off, the valid signal output by the second scan signal terminal controls the reset unit to be turned on, a third voltage signal is input to the output terminal of the driving circuit for reset, and the driving circuit outputs a DC signal.
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Patent Agency Ranking
公开(公告)号：US12134097B2
公开(公告)日：2024-11-05
申请号：US17684719
申请日：2022-03-02
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Wei Li , Baiquan Lin , Kaidi Zhang , Yunfei Bai , Ping Su , Kerui Xi , Zhenyu Jia
Abstract: A microfluidic chip and a fabrication method of the microfluidic chip are provided. The microfluidic chip includes an array substrate, and a hydrophobic layer disposed on a side of the array substrate. The hydrophobic layer includes at least one through-hole, and a through-hole of the at least one through-hole penetrates through the hydrophobic layer along a direction perpendicular to a plane of the array substrate. The microfluidic chip also includes at least one hydrophilic structure. A hydrophilic structure of the at least one hydrophilic structure is disposed in the through-hole.
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公开(公告)号：US12119559B2
公开(公告)日：2024-10-15
申请号：US17375310
申请日：2021-07-14
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu Jia , Kerui Xi , Zhen Liu , Baiquan Lin , Dengming Lei , Feng Qin , Jing Wang , Liping Zhang
CPC classification number: H01Q3/2676 , H01P1/182 , H01P1/184 , H01Q3/36 , H01Q15/147 , H01Q15/148
Abstract: Provided are a phase shifter, a preparation method thereof, and an antenna. The phase shifter includes at least one phase shifting unit, and the phase shifting unit includes a microstrip line, a photo-dielectric layer, a ground electrode, and at least one light guiding structure; the microstrip line is located on a side of the photo-dielectric layer, and the ground electrode is located on a side of the photo-dielectric layer facing away from the microstrip line; the light-guiding structure at least partially overlaps the photo-dielectric layer, and the light-guiding structure is configured to guide light into the photo-dielectric layer.
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公开(公告)号：US11984672B2
公开(公告)日：2024-05-14
申请号：US17348842
申请日：2021-06-16
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Linzhi Wang , Kerui Xi , Dengming Lei , Zhenyu Jia
CPC classification number: H01Q9/045 , H01L25/0753 , H01L25/167 , H10K59/00
Abstract: Provided are an antenna and a preparation method thereof, a phase shifter, and a communication device. The antenna includes a first electrode, a second electrode, a third electrode, and a photodielectric variable layer. The first electrode and the second electrode are respectively disposed on opposite two sides of the photodielectric variable layer. The first electrode includes a plurality of transmission electrodes, and the plurality of transmission electrodes are configured to transmit an electrical signal. The second electrode is provided with a fixed potential. The third electrode includes a plurality of radiator units, and the plurality of radiator units are configured to send the electrical signal. The antenna further includes at least one light-emitting element configured to emit light irradiated to the photodielectric variable layer to change a dielectric constant of the photodielectric variable layer.
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9.发明授权公开(公告)号：US11334740B2
公开(公告)日：2022-05-17
申请号：US16910840
申请日：2020-06-24
Inventor： Kerui Xi , Tingting Cui , Feng Qin , Xuhui Peng , Linzhi Wang
Abstract: Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
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公开(公告)号：US10409134B2
公开(公告)日：2019-09-10
申请号：US15782438
申请日：2017-10-12
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
IPC: G02F1/167 , H01L27/146 , H01L27/15 , G02F1/1676
Abstract: An electronic paper display panel, including a first and second substrate; an electrophoresis layer arranged between the first and second substrates, the electrophoresis layer including black electrophoretic particle, white electrophoretic particle and at least one color electrophoretic particle; a first electrode layer arranged at a side of the first substrate facing the second substrate including multiple first electrodes; a second electrode layer arranged at a side of the second substrate facing the first substrate including multiple second electrodes; and a drive circuit; multiple pixel areas correspond multiple second electrodes; each first electrode includes a first sub-electrode and a second sub-electrode placed in same pixel area, which are insulated from each other, correspond to one second electrode and are connected with drive circuit, the first sub-electrode receives voltage signal different from voltage signal the second sub-electrode receives; the first electrode is common electrode and the second electrode is pixel electrode.
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