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公开(公告)号：US12148564B2
公开(公告)日：2024-11-19
申请号：US17322920
申请日：2021-05-18
Applicant: Shenzhen Sunlord Electronics Co., Ltd.
Inventor： Xinshu Yu , Youyun Li , Shengcheng Xia , Zehong Yao , Yupeng Hong , Yingying Wang , Qiang Su , Wanhe Yi , Xin Che
Abstract: A manufacturing method of an integrally formed inductor, comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides a manufacturing method of an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability.
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公开(公告)号：US12100543B2
公开(公告)日：2024-09-24
申请号：US17238224
申请日：2021-04-23
Applicant: Shenzhen Sunlord Electronics Co., Ltd.
Inventor： Yingying Wang , Xinshu Yu , Shengcheng Xia , Youyun Li , Xin Che
CPC classification number: H01F27/346 , H01F27/24 , H01F27/29 , H01F27/33 , H01F41/0246 , H01F41/04
Abstract: A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55 T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.
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公开(公告)号：US11685980B2
公开(公告)日：2023-06-27
申请号：US17211775
申请日：2021-03-24
Applicant: Shenzhen Sunlord Electronics Co., Ltd.
Inventor： Xinshu Yu , Shengcheng Xia , Youyun Li , Xin Che
IPC: C22C38/34 , B22F9/08 , H01F1/01 , H01F1/26 , H01F41/02 , B22F1/102 , H01F3/08 , B22F1/10 , C22C1/10
CPC classification number: C22C38/34 , B22F1/102 , B22F1/108 , B22F9/082 , C22C1/1084 , H01F1/015 , H01F1/26 , H01F3/08 , H01F41/0246 , B22F2009/0828 , B22F2301/35 , B22F2304/10 , B22F2998/10 , B22F1/052 , B22F9/04 , B22F3/02
Abstract: A preparation method for a metal soft magnetic composite material inductor includes: smelting Fe, Si and Cr and then employing a water atomization or gas atomization means to fabricate an alloy powder; after sifting by particle size, mixing powders of different particle size levels and performing coating insulation, and performing post-granulation to obtain a metal soft composite material granulation powder; adopting the granulation powder to press a material cake, and transferring and molding same; adopting a hollow coil in a liquid-phase coating mold cavity, curing and demolding to obtain a semi-finished product, then continuously heating and curing the semi-finished product, and preparing an end electrode to obtain a finished inductor.
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公开(公告)号：US20210304956A1
公开(公告)日：2021-09-30
申请号：US17238224
申请日：2021-04-23
Applicant: Shenzhen Sunlord Electronics Co., Ltd.
Inventor： Yingying Wang , Xinshu Yu , Shengcheng Xia , Youyun Li , Xin Che
Abstract: A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.
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