公开(公告)号：US20210304956A1

公开(公告)日：2021-09-30

申请号：US17238224

申请日：2021-04-23

申请人： Shenzhen Sunlord Electronics Co., Ltd.

发明人： Yingying Wang ,  Xinshu Yu ,  Shengcheng Xia ,  Youyun Li ,  Xin Che

IPC分类号： H01F27/34 ,  H01F27/24 ,  H01F27/29 ,  H01F41/04 ,  H01F41/02 ,  H01F27/33

摘要： A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.