公开(公告)号：US20120025260A1

公开(公告)日：2012-02-02

申请号：US13190886

申请日：2011-07-26

申请人： Shigehisa OONAKAHARA ,  Kenichi Ito ,  Tooru Aoyagi ,  Yuu Hasegawa

发明人： Shigehisa OONAKAHARA ,  Kenichi Ito ,  Tooru Aoyagi ,  Yuu Hasegawa

IPC分类号： H01L33/62 ,  H01L31/0203

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a lead frame, a first semiconductor element mounted on the lead frame, a frame-like member formed on the lead frame, surrounding the first semiconductor element, and a protective resin filling a space surrounded by the frame-like member. The lead frame has an external terminal protruding outside the frame-like member. The external terminal has a barrier portion which is located at an end portion thereof protruding from the frame-like member and rises from a top surface of the external terminal.

摘要翻译： 半导体器件包括引线框架，安装在引线框架上的第一半导体元件，形成在引线框架上的围绕第一半导体元件的框架构件，以及填充由框架构件包围的空间的保护树脂。 引线框架具有突出在框架状构件外部的外部端子。 外部端子具有阻挡部，该阻挡部位于从框状部件突出的端部，并从外部端子的顶面上升。