-
公开(公告)号：US20120025260A1
公开(公告)日：2012-02-02
申请号：US13190886
申请日：2011-07-26
申请人： Shigehisa OONAKAHARA , Kenichi Ito , Tooru Aoyagi , Yuu Hasegawa
发明人： Shigehisa OONAKAHARA , Kenichi Ito , Tooru Aoyagi , Yuu Hasegawa
IPC分类号： H01L33/62 , H01L31/0203
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes a lead frame, a first semiconductor element mounted on the lead frame, a frame-like member formed on the lead frame, surrounding the first semiconductor element, and a protective resin filling a space surrounded by the frame-like member. The lead frame has an external terminal protruding outside the frame-like member. The external terminal has a barrier portion which is located at an end portion thereof protruding from the frame-like member and rises from a top surface of the external terminal.
摘要翻译： 半导体器件包括引线框架，安装在引线框架上的第一半导体元件，形成在引线框架上的围绕第一半导体元件的框架构件，以及填充由框架构件包围的空间的保护树脂。 引线框架具有突出在框架状构件外部的外部端子。 外部端子具有阻挡部，该阻挡部位于从框状部件突出的端部，并从外部端子的顶面上升。
-
2.发明授权公开(公告)号：US08525307B2
公开(公告)日：2013-09-03
申请号：US13192167
申请日：2011-07-27
IPC分类号： H01L23/495
CPC分类号： H01L23/49861 , H01L23/047 , H01L23/24 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00014 , H01L2924/20752 , H01L2924/00
摘要： A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
摘要翻译： 半导体器件包括引线框架，安装在引线框架上的半导体元件和形成在引线框架上的框架构件，围绕半导体元件，并且覆盖引线框架的侧表面并暴露引线框架的下表面 引线框架 框状构件在其侧面具有至少一个凹部。 凹部具有位于与引线框架的上表面相同的高度的顶部和位于引线框架的下表面之上的底部。
-
3.发明申请SEMICONDUCTOR DEVICE, LEAD FRAME ASSEMBLY, AND METHOD FOR FABRICATING THE SAME 失效半导体器件，引线框架组件及其制造方法公开(公告)号：US20120025361A1
公开(公告)日：2012-02-02
申请号：US13192167
申请日：2011-07-27
IPC分类号： H01L23/495 , H01L21/66
CPC分类号： H01L23/49861 , H01L23/047 , H01L23/24 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00014 , H01L2924/20752 , H01L2924/00
摘要： A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
摘要翻译： 半导体器件包括引线框架，安装在引线框架上的半导体元件和形成在引线框架上的框架构件，围绕半导体元件，并且覆盖引线框架的侧表面并暴露引线框架的下表面 引线框架 框状构件在其侧面具有至少一个凹部。 凹部具有位于与引线框架的上表面相同的高度的顶部和位于引线框架的下表面之上的底部。
-
-
搜索结果
3 条记录 (耗时 0.008 秒)
