公开(公告)号：US20160218110A1

公开(公告)日：2016-07-28

申请号：US15003659

申请日：2016-01-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei YANG ,  Chun-Ming CHEN ,  Man-Tang WU ,  Feng ZHOU ,  Xian LIU ,  Chien-Sheng SU ,  Nhan DO

IPC: H01L27/115 ,  H01L21/306 ,  H01L29/66 ,  H01L21/28

CPC classification number: H01L27/11524 ,  H01L21/28273 ,  H01L21/30604 ,  H01L27/11536 ,  H01L29/42328 ,  H01L29/66545 ,  H01L29/66825 ,  H01L29/7881

Abstract: A method of forming a memory device by forming spaced apart first and second regions with a channel region therebetween, forming a floating gate over and insulated from a first portion of the channel region, forming a control gate over and insulated from the floating gate, forming an erase gate over and insulated from the first region, and forming a select gate over and insulated from a second portion of the channel region. Forming of the floating gate includes forming a first insulation layer on the substrate, forming a first conductive layer on the first insulation layer, and performing two separate etches to form first and second trenches through the first conductive layer. A sidewall of the first conductive layer at the first trench has a negative slope and a sidewall of the first conductive layer at the second trench is vertical.

Abstract translation: 一种通过形成间隔开的第一和第二区域形成存储器件的方法，其间具有通道区域，在沟道区域的第一部分上方形成浮栅，并与沟道区域的第一部分绝缘，形成控制栅极并与浮栅绝缘，形成 擦除栅极，并与第一区域绝缘，并且形成选通栅极，并与沟道区域的第二部分绝缘。 浮置栅极的形成包括在衬底上形成第一绝缘层，在第一绝缘层上形成第一导电层，并执行两个单独的蚀刻以形成通过第一导电层的第一和第二沟槽。 第一沟槽处的第一导电层的侧壁具有负斜率，第二沟槽处的第一导电层的侧壁是垂直的。