公开(公告)号：US08895367B2

公开(公告)日：2014-11-25

申请号：US13964465

申请日：2013-08-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/36 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L21/56 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/014 ,  H01L2924/3511

Abstract: A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.

Abstract translation: 半导体封装包括：具有多个电极焊盘的有源表面和与该有源表面相对的无效表面的芯片; 密封剂，其封装所述芯片并且具有相对的第一和第二表面，所述第一表面与所述芯片的有源表面齐平; 以及形成在密封剂的第二表面上的第一和第二金属层，由此为整个结构提供刚性支撑以防止翘曲并促进整体结构的散热。

公开(公告)号：US20130330883A1

公开(公告)日：2013-12-12

申请号：US13964465

申请日：2013-08-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/014 ,  H01L2924/3511

Abstract: A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.

Abstract translation: 半导体封装包括：具有多个电极焊盘的有源表面和与该有源表面相对的无效表面的芯片; 密封剂，其封装所述芯片并且具有相对的第一和第二表面，所述第一表面与所述芯片的有源表面齐平; 以及形成在密封剂的第二表面上的第一和第二金属层，由此为整个结构提供刚性支撑以防止翘曲并促进整体结构的散热。