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公开(公告)号:US06704187B2
公开(公告)日:2004-03-09
申请号:US09961600
申请日:2001-09-24
申请人: Steve Schiveley , Mike Greenwood , Tao Liu , Peir Chu , Aaron Steyskal
发明人: Steve Schiveley , Mike Greenwood , Tao Liu , Peir Chu , Aaron Steyskal
IPC分类号: H01G432
CPC分类号: H01G4/245 , Y10T29/417
摘要: A termination assembly for a capacitor provides controlled ESR and ESL. First and second termination elements are attached to first and second foils to provide terminal connections. The first and second foils are wound into a cylinder such that the first and second termination elements form a shape within the cylinder and are spaced apart by a first distance. First and second leads are extending from the termination elements, respectively, such that the first and second leads are spaced apart by a second distance different from the first distance.
摘要翻译: 用于电容器的端接组件提供受控的ESR和ESL。 第一和第二终端元件连接到第一和第二箔以提供端子连接。 第一和第二箔被卷绕成圆柱体,使得第一和第二终端元件在圆柱体内形成一个形状并且隔开第一距离。 第一和第二引线分别从终端元件延伸,使得第一和第二引线间隔开与第一距离不同的第二距离。
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公开(公告)号:US06862784B2
公开(公告)日:2005-03-08
申请号:US10345147
申请日:2003-01-16
申请人: Tao Liu , Steve Schiveley , Peir Chu , Mike Greenwood , Aaron Steyskal
发明人: Tao Liu , Steve Schiveley , Peir Chu , Mike Greenwood , Aaron Steyskal
CPC分类号: H01G2/065 , H01G9/008 , H05K3/3426 , H05K3/3436 , Y02P70/613 , Y10T29/41 , Y10T29/417 , Y10T29/435
摘要: A method of fabricating a capacitor provides for coupling a ball grid array (BGA) lead configuration to a foil and disposing the foil within a case. The BGA lead configuration extends from the case.
摘要翻译: 制造电容器的方法提供了将球栅阵列(BGA)引线配置耦合到箔片并将箔布置在壳体内。 BGA引线配置从案例延伸。
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公开(公告)号:US06529365B1
公开(公告)日:2003-03-04
申请号:US09964806
申请日:2001-09-28
申请人: Tao Liu , Steve Schiveley , Peir Chu , Mike Greenwood , Aaron Steyskal
发明人: Tao Liu , Steve Schiveley , Peir Chu , Mike Greenwood , Aaron Steyskal
IPC分类号: H01G4236
CPC分类号: H01G2/065 , H01G9/008 , H05K3/3426 , H05K3/3436 , Y02P70/613 , Y10T29/41 , Y10T29/417 , Y10T29/435
摘要: A wound capacitor has a lead configuration that enables enhanced control over equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor has a case and a wound foil disposed within the case. A ball grid array (BGA) lead configuration is coupled to the foil and extends from the case.
摘要翻译: 绕组电容器具有能够增强对等效串联电阻(ESR)和等效串联电感(ESL)的控制的引线配置。 电容器具有设置在壳体内的外壳和缠绕箔。 球栅阵列(BGA)引线配置耦合到箔并从壳体延伸。
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公开(公告)号:US20050128677A1
公开(公告)日:2005-06-16
申请号:US10737467
申请日:2003-12-15
申请人: Aaron Steyskal , Tao Liu , Steve Schiveley , Peir Chu , Mike Greenwood
发明人: Aaron Steyskal , Tao Liu , Steve Schiveley , Peir Chu , Mike Greenwood
CPC分类号: H05K3/3426 , H01G2/065 , H01G4/228 , H01G4/32 , H05K2201/10984 , Y02P70/613 , Y10T29/41 , Y10T29/417 , Y10T29/435
摘要: A wound capacitor has a lead configuration that enables enhanced control over equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor has a case and a wound foil disposed within the case. A ball-and-lead configuration is coupled to the foil and extends from the case.
摘要翻译: 绕组电容器具有能够增强对等效串联电阻(ESR)和等效串联电感(ESL)的控制的引线配置。 电容器具有设置在壳体内的外壳和缠绕箔。 球形引线结构连接到箔片并从壳体延伸。
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公开(公告)号:US20060145360A1
公开(公告)日:2006-07-06
申请号:US11339918
申请日:2006-01-25
申请人: Aaron Steyskal , Tao Liu , Steve Schivelev , Peir Chu , Mike Greenwood
发明人: Aaron Steyskal , Tao Liu , Steve Schivelev , Peir Chu , Mike Greenwood
CPC分类号: H05K3/3426 , H01G2/065 , H01G4/228 , H01G4/32 , H05K2201/10984 , Y02P70/613 , Y10T29/41 , Y10T29/417 , Y10T29/435
摘要: A wound capacitor has a lead configuration that enables enhanced control over equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor has a case and a wound foil disposed within the case. A ball-and-lead configuration is coupled to the foil and extends from the case.
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公开(公告)号:US20050195555A1
公开(公告)日:2005-09-08
申请号:US10792257
申请日:2004-03-02
申请人: Aaron Steyskal , Larry Mosley , Tony Tran
发明人: Aaron Steyskal , Larry Mosley , Tony Tran
IPC分类号: H01G4/228
摘要: A capacitor with reduced equivalent series resistance and reduces equivalent series inductance is provided. Capacitors are provided with multiple plate assemblies that couple to a common single first polarity terminal. Capacitors are also provided with multiple plate assemblies that each couple to a respective second polarity terminal. Fan-like plate assemblies are arranged to provide increased capacitance with reduced equivalent series resistance and reduces equivalent series inductance. Capacitors are provided that mount using surface mounting technology. Capacitors are provided that conform to existing capacitor form factors.
摘要翻译: 提供了具有降低的等效串联电阻并减小等效串联电感的电容器。 电容器具有多个板组件,其耦合到公共单个第一极性端子。 电容器还设置有多个板组件,每个板组件耦合到相应的第二极性端子。 风扇板组件布置成提供增加的电容,减少等效串联电阻并减小等效的串联电感。 提供使用表面贴装技术安装的电容器。 提供符合现有电容器形状因素的电容器。
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