HIGH VOLTAGE EDGE TERMINATION STRUCTURE FOR POWER SEMICONDCUTOR DEVICES AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220157951A1

    公开(公告)日:2022-05-19

    申请号:US16950586

    申请日:2020-11-17

    摘要: A high voltage edge termination structure for a power semiconductor device is provided. The high voltage edge termination structure comprises a semiconductor body of a first conductive type, a JTE region of a second conductive type, a heavily doped channel stop region of the first conductive type, and a plurality of field plates. The JTE region is formed in the semiconductor body, wherein the JTE region is adjacent to an active region of the power semiconductor device. The heavily doped channel stop region is formed in the semiconductor body, wherein the heavily doped channel stop region is spaced apart from the JTE region. The plurality of field plates is formed on the JTE region.