公开(公告)号：US20230420176A1

公开(公告)日：2023-12-28

申请号：US18330635

申请日：2023-06-07

Applicant: TDK Corporation

Inventor： Yuuichi KAWAGUCHI ,  Naoaki FUJII ,  Tomonaga NISHIKAWA ,  Liyi CHEN ,  Mitsuo NATORI

IPC: H01F27/28 ,  H01F41/04 ,  H01F27/24

CPC classification number: H01F27/2804 ,  H01F41/041 ,  H01F27/24 ,  H01F2027/2809

Abstract: Disclosed herein is a coil component that includes a magnetic element body, and a coil part embedded in the magnetic element body. The magnetic element body includes a first region covering the coil part from one side in a coil axis direction, a second region covering the coil part from other side in the coil axis direction, and a third region positioned in an inner diameter area of the coil part so as to connect the first and second regions. The height of the coil part in the coil axis direction decreases toward the inner diameter area.

公开(公告)号：US20220375675A1

公开(公告)日：2022-11-24

申请号：US17740693

申请日：2022-05-10

Applicant: TDK CORPORATION

Inventor： Kentaro SAITO ,  Shota OTSUKA ,  Kyohei TONOYAMA ,  Tomonaga NISHIKAWA ,  Mitsuo NATORI ,  Yuuichi KAWAGUCHI ,  Junichi SHIMAMURA

IPC: H01F27/255 ,  H01F27/29

Abstract: A coil-embedded magnetic core capable of achieving improvements both in insulation and initial magnetic permeability, and coil devices thereof. The coil-embedded magnetic core embedding a coil made of a conductor, including magnetic powder and a resin, in which the coil-embedded magnetic core further includes a modifier.

公开(公告)号：US20180294090A1

公开(公告)日：2018-10-11

申请号：US15947682

申请日：2018-04-06

Applicant: TDK Corporation

Inventor： Tomonaga NISHIKAWA ,  Kouji KAWAMURA ,  Hidenori TSUTSUI ,  Mitsuo NATORI ,  Hitoshi OZAWA

IPC: H01F27/29 ,  H02M7/00 ,  H01F5/00

CPC classification number: H01F27/29 ,  H01F5/003 ,  H01F17/0033 ,  H01F27/292 ,  H01F2005/006 ,  H01F2017/0066 ,  H01F2017/046 ,  H02M7/003

Abstract: Disclosed herein is a coil component that includes a spiral conductor, a magnetic material layer covering the spiral conductor and having a through hole exposing an end of the spiral conductor, a through-hole conductor embedded in the through hole and has first region and second regions that are exposed from the magnetic material layer, a first conductor layer formed on an upper surface of the magnetic material layer and covering the first region of the through-hole conductor without covering the second region, and a second conductor layer covering the first conductor layer and the second region of the through-hole conductor, wherein the second conductor layer has a lower resistance than the first conductor layer.

公开(公告)号：US20230238170A1

公开(公告)日：2023-07-27

申请号：US18157955

申请日：2023-01-23

Applicant: TDK Corporation

Inventor： Yuuichi KAWAGUCHI ,  Mitsuo NATORI ,  Azuma SATOH

IPC: H01F27/29 ,  H01F17/00 ,  H01F41/04 ,  H01F17/04

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F41/041 ,  H01F17/04 ,  H01F2017/0073 ,  H01F2017/0066 ,  H01F2017/048

Abstract: Disclosed herein is a coil component that includes: a coil part having a structure in which alternately stacking a plurality of conductor layers each including a spiral coil pattern and a plurality of insulating layers; a first magnetic layer disposed in an inner diameter area of the coil part, in an outside area of the coil part, and on one side in an axial direction of the coil part; and a second magnetic layer disposed on other side in the axial direction of the coil part. Each of the first and second magnetic layers comprises a composite magnetic material containing magnetic fillers and binder resin. The content of the magnetic filers in the first magnetic layer is higher than the content of the magnetic fillers in the second magnetic layer.

公开(公告)号：US20230071379A1

公开(公告)日：2023-03-09

申请号：US17798496

申请日：2021-02-10

Applicant: TDK Corporation

Inventor： Yuuichi KAWAGUCHI ,  Tomonaga NISHIKAWA ,  Takuya TAKEUCHI ,  Mitsuo NATORI

IPC: H01F27/32 ,  H01F17/04 ,  H01F41/04

Abstract: To achieve a high inductance value while reducing the entire thickness in a coil component having a structure in which spiral coil patterns are stacked. A coil component includes: a coil part having a structure in which interlayer insulating films and spirally wound coil patterns are alternately stacked in the axial direction of the coil component; and magnetic element members embedding therein the coil part. The interlayer insulating film covering, from one end side in the axial direction, one coil pattern positioned at the one end in the axial direction is higher in permeability than the interlayer insulating films. Thus, the one coil pattern positioned at the end portion is covered with the interlayer insulating film having a high permeability, so that it is possible to achieve a high inductance value while reducing the entire thickness.

公开(公告)号：US20230352234A1

公开(公告)日：2023-11-02

申请号：US18245408

申请日：2021-09-07

Applicant: TDK Corporation

Inventor： Yuuichi KAWAGUCHI ,  Mitsuo NATORI ,  Azuma SATOH ,  Naoaki FUJII ,  Tomonaga NISHIKAWA

IPC: H01F27/32 ,  H01F27/02 ,  H01F27/28 ,  H01F27/255 ,  H01F41/00 ,  H01F41/12

CPC classification number: H01F27/327 ,  H01F27/022 ,  H01F27/2852 ,  H01F27/255 ,  H01F27/323 ,  H01F41/005 ,  H01F41/122 ,  H01F41/127

Abstract: A coil component includes: a magnetic element body made of resin containing conductive magnetic powder; a coil part 20 obtained by alternately stacking a plurality of conductor layers and a plurality of interlayer insulating layers, the plurality of conductor layers respectively including coil conductor patterns embedded in the magnetic element body and electrode patterns exposed from the magnetic element body; external terminals provided respectively on the electrode patterns and electrode patterns; and a protective insulating layer covering the magnetic element body in such a manner as to expose the external terminals therethrough. The magnetic element body is thus covered with the protective insulating layer, so that it is possible to prevent adhesion of plating to an unnecessary portion and exposure of the coil conductor patterns even when the surfaces of the external terminals are subjected to electrolytic plating.

公开(公告)号：US20230170135A1

公开(公告)日：2023-06-01

申请号：US17988338

申请日：2022-11-16

Applicant: TDK Corporation

Inventor： Yuuichi KAWAGUCHI ,  Masanori SUZUKI ,  Tomonaga NISHIKAWA ,  Mitsuo NATORI ,  Osamu NAKADA

IPC: H01F27/29 ,  H01F17/04

CPC classification number: H01F27/292 ,  H01F17/04

Abstract: Disclosed herein is a chip-type coil component that includes a magnetic element body, a coil pattern embedded in the magnetic element body, and a terminal electrode connected to the coil pattern and exposed to a mounting surface of the magnetic element body. A recessed part obtained by removing a part of the magnetic element body is formed in an upper surface of the magnetic element body positioned on a side opposite the mounting surface to function as a directional mark.

公开(公告)号：US20220102044A1

公开(公告)日：2022-03-31

申请号：US17486264

申请日：2021-09-27

Applicant: TDK Corporation

Inventor： Takeshi OKUMURA ,  Kouji KAWAMURA ,  Hidenori TSUTSUI ,  Kenichi ICHINOSE ,  Taichi HIROSE ,  Mitsuo NATORI ,  Kyohei YAZAKI ,  Shouji SHIMADA

IPC: H01F17/00 ,  H01F27/29

Abstract: Disclosed herein is a coil component that includes a plurality of conductor layers including first, second, third, and fourth conductor layers stacked one on another in this order. First and third planar spiral coils are formed in the first and third conductor layers. A second planar spiral coil is formed in the second and fourth conductor layers. A pattern width of the second planar spiral coil formed in the second conductor layer is smaller than that of the second planar spiral coil formed in the fourth conductor layer, or a pattern width of each of the first and third planar spiral coils formed in the third conductor layer is smaller than that of each of the first and third planar spiral coils formed in the first conductor layer.