公开(公告)号：US20160004021A1

公开(公告)日：2016-01-07

申请号：US14793114

申请日：2015-07-07

Applicant: TERAXION INC.

Inventor： François PELLETIER ,  Christine LATRASSE ,  Marie-Josée PICARD ,  Michel POULIN ,  Yves PAINCHAUD

IPC: G02B6/42 ,  G02B6/38

CPC classification number: G02B6/4292 ,  G02B6/3839 ,  G02B6/4204 ,  G02B6/421 ,  G02B6/428

Abstract: A connectorized optical chip assembly connectable to an external optical fiber having a fiber connector is provided. The connectorized optical chip assembly includes a substrate, an optical chip having an on-chip optical waveguide and a connectorized interface. The connectorized interface includes an optical coupling element mounted in optical alignment with the on-chip optical waveguide. The connectorized interface includes a chip connector engaging the optical coupling element and configured for mating with the fiber connector of the external optical fiber, so as to provide an optical coupling of light between the optical coupling element and the external optical fiber. The connectorized optical chip assembly also includes a mechanical support structure supporting the connectorized interface onto the substrate. Preferably, the components of the connectorized optical assembly are made of materials heat resistant to temperatures used to melt solder in surface mount processes.

Abstract translation: 提供一种可连接到具有光纤连接器的外部光纤的连接的光学芯片组件。 连接的光学芯片组件包括衬底，具有片上光波导的光学芯片和连接器化接口。 连接器接口包括与片上光波导光学对准安装的光耦合元件。 连接器接口包括接合光耦合元件并被配置为与外部光纤的光纤连接器配合的芯片连接器，以便在光耦合元件和外部光纤之间提供光的光耦合。 连接的光学芯片组件还包括支撑衬底上的连接器界面的机械支撑结构。 优选地，连接器化光学组件的部件由耐热表面贴装工艺中熔化焊料的温度的材料制成。

公开(公告)号：US20150338574A1

公开(公告)日：2015-11-26

申请号：US14718273

申请日：2015-05-21

Applicant: TERAXION INC.

Inventor： François PELLETIER

IPC: G02B6/02 ,  B23K26/34 ,  B23K26/00

CPC classification number: G02B6/02195 ,  B23K26/21 ,  B23K26/262 ,  B23K26/282 ,  B23K26/32 ,  B23K26/34 ,  B23K2101/04 ,  B23K2103/166 ,  G02B6/0218 ,  G02B6/022 ,  G02B6/02209

Abstract: A post-assembly wavelength-tuning method for an optical filter provided along an optical fiber mounted under tension in a packaging assembly is provided. The packaging assembly includes at least one packaging component mechanically coupled to the optical fiber and optically accessible from outside of the packaging assembly. The method includes a step of measuring a post-assembly spectral response of the optical filter and determining therefrom a spectral deviation with respect to a target spectral response. The method also includes a step of forming one or more laser-welded zones on the packaging component so as to cause a permanent deformation thereof. The permanent deformation induces a modification in length of the optical fiber, thereby changing the post-assembly spectral response of the optical filter to compensate for the measured spectral deviation.

Abstract translation: 提供了一种用于沿着安装在包装组件中的张力下的光纤设置的滤光器的后装配波长调谐方法。 包装组件包括至少一个机械耦合到光纤并且可从包装组件的外部光学地接近的包装部件。 该方法包括测量光学滤波器的装配后光谱响应并由此确定相对于目标光谱响应的光谱偏差的步骤。 该方法还包括在包装部件上形成一个或多个激光焊接区域以使其永久变形的步骤。 永久变形引起光纤长度的改变，从而改变光学滤波器的组装后光谱响应，以补偿测量的光谱偏差。