公开(公告)号：US12062596B2

公开(公告)日：2024-08-13

申请号：US17373958

申请日：2021-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Chien Hao Wang ,  Bob Lee

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/4821 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2924/182

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

公开(公告)号：US20230017286A1

公开(公告)日：2023-01-19

申请号：US17373958

申请日：2021-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Chien Hao Wang ,  Bob Lee

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.