公开(公告)号：US10910293B1

公开(公告)日：2021-02-02

申请号：US16665459

申请日：2019-10-28

Applicant: Texas Instruments Incorporated

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/495 ,  H01L23/50 ,  H01L23/00

Abstract: A leadframe includes a die pad having a plurality of sides which collectively define the rectangular die pad area including at least two securing sides that include a linear portion with a cantilever interrupting the linear portion. The die pad has a top surface defining a top plane and a bottom surface defining a bottom plane. Lead terminals are beyond the die pad. The cantilevers have a fixed end and a free end opposite the fixed ends that enables flexing or bending responsive to a received force. The free ends include a distal end with an electronic component locking feature. The fixed ends are positioned beyond the die pad area, and the electronic component locking feature extends inward over the rectangular die pad area for providing mechanical support and for securing the electronic component.

公开(公告)号：US20230017286A1

公开(公告)日：2023-01-19

申请号：US17373958

申请日：2021-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Chien Hao Wang ,  Bob Lee

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

公开(公告)号：US20220246545A1

公开(公告)日：2022-08-04

申请号：US17719235

申请日：2022-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US09786582B2

公开(公告)日：2017-10-10

申请号：US15010938

申请日：2016-01-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chia-Yu Chang ,  Bob Lee ,  Steven Su

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H05K1/11

CPC classification number: H01L23/49503 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/00012

Abstract: A leadframe for encasing in a mold material includes a plurality of interconnected support members. A die pad is connected to the support members and includes a bottom surface. The die pad is configured to receive a die. A downset is connected to the die pad and positioned below the bottom surface. The downset includes at least one wall defining an interior volume for receiving a flow of the mold material to reduce the velocity of the mold material flow through the downset.

公开(公告)号：US20210193590A1

公开(公告)日：2021-06-24

申请号：US16724179

申请日：2019-12-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US12062596B2

公开(公告)日：2024-08-13

申请号：US17373958

申请日：2021-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Chien Hao Wang ,  Bob Lee

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/4821 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2924/182

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

公开(公告)号：US20240258210A1

公开(公告)日：2024-08-01

申请号：US18104278

申请日：2023-01-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bob Lee ,  Kim Hong Lucas Chai

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/858 ,  H01L2224/92247

Abstract: A semiconductor package includes a metallic substrate, the metallic substrate including a roughened surface, a semiconductor die including bond pads, and an adhesive between the roughened surface of a topside of the metallic substrate and the semiconductor die, therein bonding the semiconductor die to the metallic substrate. The adhesive includes a resin. The metallic substrate further includes a groove about a perimeter of the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic substrate. The groove straddles the topside and a sidewall of the metallic substrate.

公开(公告)号：US20240047381A1

公开(公告)日：2024-02-08

申请号：US18488981

申请日：2023-10-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

CPC classification number: H01L23/562 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49582 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/681 ,  G06T7/0004 ,  G06T7/70 ,  H01L21/4825 ,  G06T2207/30148

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US11791289B2

公开(公告)日：2023-10-17

申请号：US17719235

申请日：2022-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

CPC classification number: H01L23/562 ,  G06T7/0004 ,  G06T7/70 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/681 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49582 ,  G06T2207/30148

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US11302652B2

公开(公告)日：2022-04-12

申请号：US16724179

申请日：2019-12-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.