Data and power isolation barrier
    1.
    发明授权

    公开(公告)号:US11443889B2

    公开(公告)日:2022-09-13

    申请号:US16903618

    申请日:2020-06-17

    Abstract: A semiconductor package includes a transformer having a primary winding and a secondary winding. The primary winding has first and second terminals and a pair of taps. The secondary winding has first and second terminals and a pair of taps. The semiconductor package includes first and second data transfer circuits, a bridge, and a rectifier. The first data transfer circuit is coupled to the pair of taps of the primary winding. The second data transfer circuit is coupled to the pair of taps of the secondary winding. The bridge is coupled to the first and second terminals of the primary winding. The rectifier is coupled to the first and second terminals of the secondary winding.

    MULTI-CHANNEL PERIPHERAL INTERCONNECT SUPPORTING SIMULTANEOUS VIDEO AND BUS PROTOCOLS
    2.
    发明申请
    MULTI-CHANNEL PERIPHERAL INTERCONNECT SUPPORTING SIMULTANEOUS VIDEO AND BUS PROTOCOLS 有权
    多通道外设互连支持同时视频和总线协议

    公开(公告)号:US20140297898A1

    公开(公告)日:2014-10-02

    申请号:US14212810

    申请日:2014-03-14

    Abstract: A method includes generating, by a control unit of a first device, a handshaking signal to be transmitted to a second device via a second channel. The method further includes based on the handshaking signal being acknowledged by the second device, configuring, by the control unit, the second channel to communicate non-display data and configuring a first channel connecting the first device to the second device to selectively communicate either display data or non-display data; and based on the handshaking signal being not acknowledged by the second device, configuring, by the control unit, the first channel to communicate display data.

    Abstract translation: 一种方法包括通过第一设备的控制单元通过第二通道产生要发送到第二设备的握手信号。 该方法还包括基于由第二设备确认的握手信号,由控制单元配置第二通道以传送非显示数据并配置将第一设备连接到第二设备的第一通道,以选择性地通信任一显示器 数据或非显示数据; 并且基于所述握手信号不被所述第二设备确认,由所述控制单元配置所述第一信道来传送显示数据。

    Lead Frame for Multi-Chip Modules With Integrated Surge Protection

    公开(公告)号:US20210159192A1

    公开(公告)日:2021-05-27

    申请号:US16697617

    申请日:2019-11-27

    Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.

    Lead frame for multi-chip modules with integrated surge protection

    公开(公告)号:US11380631B2

    公开(公告)日:2022-07-05

    申请号:US16697617

    申请日:2019-11-27

    Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.

Patent Agency Ranking