公开(公告)号：US10730645B2

公开(公告)日：2020-08-04

申请号：US15494315

申请日：2017-04-21

Applicant: THE BOEING COMPANY

Inventor： Eric S. Mindock ,  James H. Mabe ,  Frederick Theodore Calkins ,  Abraham Naroll Gissen ,  Miguel A. Estevez

IPC: H05K7/20 ,  F28F13/00 ,  F28F21/00 ,  B64G1/50 ,  F28D21/00 ,  H01L23/427 ,  H01L23/42 ,  H01L23/373

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

公开(公告)号：US20200024010A1

公开(公告)日：2020-01-23

申请号：US16430058

申请日：2019-06-03

Applicant: The Boeing Company

Inventor： Miguel A. Estevez ,  Jason D. Flathom ,  Gary E. Lemke ,  Dennis Yoichi Nakasone ,  Christopher P. Volk ,  Elvis D. Silva

IPC: B64G1/64 ,  B64G1/00 ,  B64G1/10

Abstract: In an example, a spacecraft system includes a plurality of spacecraft in a stack. The stack has one or more layers, each layer includes at least two spacecraft, and each spacecraft is releasably coupled to one or more adjacent spacecraft in the stack. The spacecraft system also includes a controller configured to, for each layer, (i) cause the layer to release from the stack, and (ii) after the layer releases from the stack, cause the at least two spacecraft in the layer to release from each other.

公开(公告)号：US10351268B2

公开(公告)日：2019-07-16

申请号：US15373166

申请日：2016-12-08

Applicant: The Boeing Company

Inventor： Miguel A. Estevez ,  Jason D. Flathom ,  Gary E. Lemke ,  Dennis Yoichi Nakasone ,  Christopher P. Volk ,  Elvis D. Silva

IPC: B64G1/64 ,  B64G1/00 ,  B64G1/10

Abstract: A spacecraft system includes a plurality of spacecraft in a stack. The stack has one or more layers, each layer includes at least two spacecraft, and each spacecraft is releasably coupled to one or more adjacent spacecraft in the stack. The spacecraft system also includes a controller configured to, for each layer, (i) cause the layer to release from the stack, and (ii) after the layer releases from the stack, cause the at least two spacecraft in the layer to release from each other.

公开(公告)号：US20200331639A1

公开(公告)日：2020-10-22

申请号：US16913855

申请日：2020-06-26

Applicant: THE BOEING COMPANY

Inventor： Eric S. Mindock ,  James H. Mabe ,  Frederick Theodore Calkins ,  Abraham NaroII Gissen ,  Miguel A. Estevez

IPC: B64G1/50 ,  F28D21/00 ,  H05K7/20 ,  H01L23/427 ,  H01L23/42 ,  F28F13/00 ,  H01L23/373

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

公开(公告)号：US20180331433A1

公开(公告)日：2018-11-15

申请号：US15595143

申请日：2017-05-15

Applicant: The Boeing Company

Inventor： William J. Ceely ,  Tom M. Hikido ,  John E. Baldauf ,  Miguel A. Estevez

IPC: H01Q21/26 ,  H01Q1/08 ,  H01Q1/28 ,  H01Q3/04 ,  H01P3/10

CPC classification number: H01Q21/26 ,  H01Q1/08 ,  H01Q1/084 ,  H01Q1/288 ,  H01Q11/10 ,  H01Q25/001

Abstract: Foldable dipole array antennas are disclosed. A disclosed example apparatus includes a helical communication line of a dipole array antenna, and hinges spaced along the helical communication line. The apparatus also includes dipole branches operatively coupled to the helical communication line, where the dipole branches are to be moved, at the hinges, between deployed and un-deployed states.

公开(公告)号：US20180305043A1

公开(公告)日：2018-10-25

申请号：US15494315

申请日：2017-04-21

Applicant: THE BOEING COMPANY

Inventor： Eric S. Mindock ,  James H. Mabe ,  Frederick Theodore Calkins ,  Abraham NaroII Gissen ,  Miguel A. Estevez

IPC: B64G1/50 ,  F28D21/00 ,  F28F21/08 ,  H05K7/20

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

公开(公告)号：US20180162561A1

公开(公告)日：2018-06-14

申请号：US15373166

申请日：2016-12-08

Applicant: The Boeing Company

Inventor： Miguel A. Estevez ,  Jason D. Flathom ,  Gary E. Lemke ,  Dennis Yoichi Nakasone ,  Christopher P. Volk ,  Elvis D. Silva

IPC: B64G1/64 ,  B64G1/00 ,  B64G1/10

CPC classification number: B64G1/645 ,  B64G1/002 ,  B64G1/1085 ,  B64G1/641 ,  B64G2001/643

Abstract: In an example, a spacecraft system includes a plurality of spacecraft in a stack. The stack has one or more layers, each layer includes at least two spacecraft, and each spacecraft is releasably coupled to one or more adjacent spacecraft in the stack. The spacecraft system also includes a controller configured to, for each layer, (i) cause the layer to release from the stack, and (ii) after the layer releases from the stack, cause the at least two spacecraft in the layer to release from each other.

公开(公告)号：US11225339B2

公开(公告)日：2022-01-18

申请号：US16913855

申请日：2020-06-26

Applicant: THE BOEING COMPANY

Inventor： Eric S. Mindock ,  James H. Mabe ,  Frederick Theodore Calkins ,  Abraham Naroll Gissen ,  Miguel A. Estevez

IPC: H05K7/20 ,  B64G1/50 ,  F28D21/00 ,  H01L23/427 ,  H01L23/42 ,  F28F13/00 ,  H01L23/373

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

公开(公告)号：US10717551B2

公开(公告)日：2020-07-21

申请号：US16430058

申请日：2019-06-03

Applicant: The Boeing Company

Inventor： Miguel A. Estevez ,  Jason D. Flathom ,  Gary E. Lemke ,  Dennis Yoichi Nakasone ,  Christopher P. Volk ,  Elvis D. Silva

IPC: B64G1/64 ,  B64G1/00 ,  B64G1/10

Abstract: A spacecraft system includes a plurality of spacecraft in a stack. The stack has one or more layers, each layer includes at least two spacecraft, and each spacecraft is releasably coupled to one or more adjacent spacecraft in the stack. The spacecraft system also includes a controller configured to, for each layer, (i) cause the layer to release from the stack, and (ii) after the layer releases from the stack, cause the at least two spacecraft in the layer to release from each other.

公开(公告)号：US10411363B2

公开(公告)日：2019-09-10

申请号：US15595143

申请日：2017-05-15

Applicant: The Boeing Company

Inventor： William J. Ceely ,  Tom M. Hikido ,  John E. Baldauf ,  Miguel A. Estevez

IPC: H01Q1/36 ,  H01Q21/26 ,  H01Q1/08 ,  H01Q1/28 ,  H01Q11/10 ,  H01Q25/00

Abstract: Foldable dipole array antennas are disclosed. A disclosed example apparatus includes a helical communication line of a dipole array antenna, and hinges spaced along the helical communication line. The apparatus also includes dipole branches operatively coupled to the helical communication line, where the dipole branches are to be moved, at the hinges, between deployed and un-deployed states.