公开(公告)号：US20210351057A1

公开(公告)日：2021-11-11

申请号：US17381823

申请日：2021-07-21

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Yasushi TAMURA

IPC: H01L21/68 ,  H01L21/67 ,  H01L23/00

Abstract: a mounting device and a mounting method is provided with which, after lowering a mounting head holding a chip component in a direction perpendicular to a substrate to bring the chip component into close contact with the substrate subsequent to positioning the chip component and the substrate, a control unit causes a recognition mechanism to start a parallel recognition operation of a chip recognition mark and a substrate recognition mark and recognize the chip recognition mark and the substrate recognition mark through the mounting head in a mounted state in which the chip component is in close contact with the substrate, and calculates mounting position accuracy of the chip component and the substrate.

公开(公告)号：US20210351056A1

公开(公告)日：2021-11-11

申请号：US17381720

申请日：2021-07-21

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Yasushi TAMURA

IPC: H01L21/68 ,  H01L21/67 ,  H01L23/00

Abstract: A mounting device comprises a recognition mechanism and a control unit. The recognition mechanism recognizes a chip recognition mark and a substrate recognition mark through a mounting head and from above the mounting head and is movable in an in-plane direction of a substrate surface of a substrate. The control unit is connected to the recognition mechanism, calculates an amount of misalignment between a chip component and the substrate from position information about the chip recognition mark and the substrate recognition mark obtained from the recognition mechanism, and performs positioning by driving the mounting head and/or the substrate stage according to the amount of misalignment. The recognition mechanism has a chip recognition sensor for recognizing the chip recognition mark and a substrate recognition sensor for recognizing the substrate recognition mark provided independently so that focal positions thereof are different via a common optical axis path.

公开(公告)号：US20230163096A1

公开(公告)日：2023-05-25

申请号：US18152478

申请日：2023-01-10

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Katsumi TERADA ,  Kenji HAMAKAWA ,  Takashi HARE ,  Yasushi TAMURA ,  Kensuke TASHIMA

IPC: H01L23/00 ,  H05K13/04 ,  H05K13/08

CPC classification number: H01L24/75 ,  H05K13/04 ,  H05K13/0812 ,  H05K13/0815 ,  H01L24/83 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/75804 ,  H01L2224/83201 ,  H01L2224/83132 ,  H01L2224/8313

Abstract: A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.