公开(公告)号：US20240371657A1

公开(公告)日：2024-11-07

申请号：US18775597

申请日：2024-07-17

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Shimpei AOKI ,  Takashi HARE ,  Kenji HAMAKAWA ,  Katsumi TERADA

IPC: H01L21/52 ,  H01L21/66 ,  H01L23/544

Abstract: A mounting device mounts a chip component having a chip recognition mark and a substrate having a substrate recognition mark. An attachment tool has transparency and has a tool recognition mark. The attachment tool holds a surface of the chip component opposite to a surface having the chip recognition mark. A chip position recognition unit simultaneously acquires position information of the chip recognition mark and of the tool recognition mark. The substrate position recognition unit acquires position information of the substrate recognition mark and of the tool recognition mark. A control unit moves a substrate stage holding the substrate or the attachment tool in the in-plane direction of the substrate on the basis of information obtained by the chip position recognition unit and by the substrate position recognition unit to perform alignment between the chip component and the substrate.

公开(公告)号：US20250096016A1

公开(公告)日：2025-03-20

申请号：US18726891

申请日：2022-12-22

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Kenji HAMAKAWA ,  Takashi HARE ,  Kensuke TASHIMA ,  Shigeru TOHNO ,  Ken KITAMURA

IPC: H01L21/67 ,  H01L21/60 ,  H01L21/687

Abstract: A positioning device is provided for determining a relative position between a substrate and a processing unit that is configured to perform an attachment process, when performing the attachment process at a prescribed position of the substrate. The positioning device comprises a substrate table configured to hold the substrate, a processing position movement mechanism including a driving unit configured to move the substrate table and the processing unit relative to each other, and a braking unit configured to restrict movement, caused by the driving unit, of at least one of the substrate table and the processing unit, and a control unit connected to the driving unit and the braking unit. The control unit is configured to restrict, by using the braking unit, the movement of the at least one of the substrate table and the processing unit during the attachment process.

公开(公告)号：US20230163096A1

公开(公告)日：2023-05-25

申请号：US18152478

申请日：2023-01-10

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Katsumi TERADA ,  Kenji HAMAKAWA ,  Takashi HARE ,  Yasushi TAMURA ,  Kensuke TASHIMA

IPC: H01L23/00 ,  H05K13/04 ,  H05K13/08

CPC classification number: H01L24/75 ,  H05K13/04 ,  H05K13/0812 ,  H05K13/0815 ,  H01L24/83 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/75804 ,  H01L2224/83201 ,  H01L2224/83132 ,  H01L2224/8313

Abstract: A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.