公开(公告)号：US20240371657A1

公开(公告)日：2024-11-07

申请号：US18775597

申请日：2024-07-17

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Shimpei AOKI ,  Takashi HARE ,  Kenji HAMAKAWA ,  Katsumi TERADA

IPC: H01L21/52 ,  H01L21/66 ,  H01L23/544

Abstract: A mounting device mounts a chip component having a chip recognition mark and a substrate having a substrate recognition mark. An attachment tool has transparency and has a tool recognition mark. The attachment tool holds a surface of the chip component opposite to a surface having the chip recognition mark. A chip position recognition unit simultaneously acquires position information of the chip recognition mark and of the tool recognition mark. The substrate position recognition unit acquires position information of the substrate recognition mark and of the tool recognition mark. A control unit moves a substrate stage holding the substrate or the attachment tool in the in-plane direction of the substrate on the basis of information obtained by the chip position recognition unit and by the substrate position recognition unit to perform alignment between the chip component and the substrate.

公开(公告)号：US20240100558A1

公开(公告)日：2024-03-28

申请号：US18473395

申请日：2023-09-25

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Kenji HAMAKAWA ,  Hisayoshi TAJIMA ,  Toshifumi ITO

IPC: B05C9/12 ,  B05D3/04

CPC classification number: B05C9/12 ,  B05D3/0453 ,  F26B17/00

Abstract: A coating device is provided with a stage on which a substrate is configured to be placed, an applicator movably arranged relative to the substrate placed on the stage and configured to discharge a coating liquid from a nozzle to form a coating film on the substrate, and a dryer having an air supply port with at least one porous member. The dryer is configured to dry the coating film formed on the substrate by the applicator by supplying air to the coating film from the air supply port. The at least one porous member is configured and arranged to suppress formation of local variations in an amount of air supplied from the air supply port.

公开(公告)号：US20250096016A1

公开(公告)日：2025-03-20

申请号：US18726891

申请日：2022-12-22

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Kenji HAMAKAWA ,  Takashi HARE ,  Kensuke TASHIMA ,  Shigeru TOHNO ,  Ken KITAMURA

IPC: H01L21/67 ,  H01L21/60 ,  H01L21/687

Abstract: A positioning device is provided for determining a relative position between a substrate and a processing unit that is configured to perform an attachment process, when performing the attachment process at a prescribed position of the substrate. The positioning device comprises a substrate table configured to hold the substrate, a processing position movement mechanism including a driving unit configured to move the substrate table and the processing unit relative to each other, and a braking unit configured to restrict movement, caused by the driving unit, of at least one of the substrate table and the processing unit, and a control unit connected to the driving unit and the braking unit. The control unit is configured to restrict, by using the braking unit, the movement of the at least one of the substrate table and the processing unit during the attachment process.

公开(公告)号：US20240149468A1

公开(公告)日：2024-05-09

申请号：US18549824

申请日：2021-12-15

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Hiroto TANAKA ,  Kenji HAMAKAWA ,  Tomonori KAWAMURA

IPC: B25J15/04 ,  B25J15/06

CPC classification number: B25J15/0441 ,  B25J15/0616

Abstract: A collet replacement mechanism for replacing a collet of a pickup tool that is configured to pick up chip components by suction using the collet comprises an attachment configured to hold the collet on a bottom surface thereof, an attachment holder disposed at a lower part of the pickup tool and configured to hold an upper part of the attachment by magnetic force, and an attachment storage unit having a guide that is configured to latch the attachment to store the attachment, the attachment being detachable from the attachment holder in a state of being latched to the guide.

公开(公告)号：US20230163096A1

公开(公告)日：2023-05-25

申请号：US18152478

申请日：2023-01-10

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Katsumi TERADA ,  Kenji HAMAKAWA ,  Takashi HARE ,  Yasushi TAMURA ,  Kensuke TASHIMA

IPC: H01L23/00 ,  H05K13/04 ,  H05K13/08

CPC classification number: H01L24/75 ,  H05K13/04 ,  H05K13/0812 ,  H05K13/0815 ,  H01L24/83 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/75804 ,  H01L2224/83201 ,  H01L2224/83132 ,  H01L2224/8313

Abstract: A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.