公开(公告)号：US10749046B2

公开(公告)日：2020-08-18

申请号：US16201959

申请日：2018-11-27

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Chia-Wei Chen ,  Shin-Wen Chen

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/18

Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.

公开(公告)号：US10574875B2

公开(公告)日：2020-02-25

申请号：US16170037

申请日：2018-10-25

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Chia-Wei Chen ,  Shin-Wen Chen ,  Ding-Nan Huang

IPC: H04N5/225 ,  H04N5/232 ,  G03B3/10 ,  G03B7/02 ,  G02B7/02

Abstract: A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.

公开(公告)号：US10785467B2

公开(公告)日：2020-09-22

申请号：US16248996

申请日：2019-01-16

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Shin-Wen Chen ,  Ye-Quang Chen ,  Jing-Wei Li ,  Sheng-Jie Ding ,  Chia-Wei Chen

IPC: H04N13/257 ,  H04N9/07 ,  H04N13/25 ,  H04N5/225

Abstract: A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.