Camera module of electronic device

    公开(公告)号:US11294138B2

    公开(公告)日:2022-04-05

    申请号:US16369068

    申请日:2019-03-29

    Abstract: A camera module of an electronic device includes a lens body and a bracket. The lens body includes a base mount. The bracket includes a main body and a conductive member. The main body is made of electrically non-conductive material and is configured to fixedly mount the lens body. The conductive member is received within the main body and is configured to electrically couple the base mount to a housing of the electronic device to discharge electric charge accumulated on the base mount.

    Lens module
    3.
    发明授权

    公开(公告)号:US11175493B2

    公开(公告)日:2021-11-16

    申请号:US16438654

    申请日:2019-06-12

    Abstract: A camera module includes a lens base, a lens group, and a switching mechanism. The lens base defines a through hole. The lens group is received within the through hole. The switching mechanism includes a switching base, an optical path conversion member, and a driving member. The switching base is mounted on the lens base and defines a light guide cavity communicating with the through hole. The switching base defines a front aperture and a rear aperture. The front aperture and the rear aperture communicate with the light guide cavity. The optical path conversion member includes a reflective surface. The driving member is mounted within the light guide cavity. The driving member drives the optical light conversion member to rotate to cause the reflective surface to reflect light entering through the front aperture or the rear aperture to the lens group.

    Non-ghosting imaging device
    5.
    发明授权

    公开(公告)号:US10914943B2

    公开(公告)日:2021-02-09

    申请号:US16231996

    申请日:2018-12-25

    Abstract: A camera device with anti-ghosting and anti-flare properties includes a printed circuit board; an image sensor mounted on the printed circuit board; and a supporting bracket fixed on the printed circuit board. The supporting bracket includes a supporting plate and perpendicular side wall. The supporting plate and the side wall together form a receiving room covering the image sensor, the supporting plate is opened to form a step portion. The step portion comprises a matte top bearing surface, and a protecting sheet fixed on the matte top bearing surface.

    Optical projection module with improved heat dissipation

    公开(公告)号:US10712642B2

    公开(公告)日:2020-07-14

    申请号:US16182565

    申请日:2018-11-06

    Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.

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