公开(公告)号：US20240339326A1

公开(公告)日：2024-10-10

申请号：US18297946

申请日：2023-04-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Fang-I Chen ,  Pei-Keng Tsai ,  Hui-Chi Huang

IPC: H01L21/304 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/304 ,  H01L21/67051 ,  H01L21/67288 ,  H01L21/68714

Abstract: A method of trimming a wafer includes securing the wafer on a top surface of a wafer chuck of a wafer edge trimming apparatus, directing a water jet at an edge of the wafer to form a plurality of cracks at uniform intervals along the edge of the wafer, inserting a wedge of a removal module into a first crack of the plurality of cracks, and rotating the wafer, where during the rotation of the wafer, the wedge expands the first crack of the plurality of cracks and removes material from the edge of the wafer.

公开(公告)号：US20240326195A1

公开(公告)日：2024-10-03

申请号：US18193405

申请日：2023-03-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Fang-I Chen ,  Pei-Keng Tsai ,  Hui-Chi Huang

IPC: B24B3/46

CPC classification number: B24B3/46

Abstract: An apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.