公开(公告)号：US20240271314A1

公开(公告)日：2024-08-15

申请号：US18167755

申请日：2023-02-10

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Wen-Hao CHENG ,  Hsuan-Chih CHU ,  Yen-Yu CHEN ,  Zong-Kun LIN

IPC分类号： C25D21/08 ,  C25D17/02

CPC分类号： C25D21/08 ,  C25D17/02

摘要： The present disclosure is directed to a fluid head that is configured to eject a first fluid (e.g., a liquid state fluid) and a second fluid (e.g., a gaseous state fluid). The fluid head is movable in a rotatable-fashion and a translatable-fashion such that the fluid head may be utilized to increase a speed and decrease a period of time for cleaning and drying a workpiece after an electro-chemical polishing (ECP) process or step. The fluid head may also be utilized to increase a speed and decrease a period of time for beveling an edge of a conductive layer on the workpiece. The present disclosure is also directed to methods for cleaning and drying the workpiece as well as beveling the conductive layer of the workpiece utilizing the fluid head.

公开(公告)号：US20210388524A1

公开(公告)日：2021-12-16

申请号：US16901967

申请日：2020-06-15

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Zong-Kun LIN ,  Hsuan-Chih CHU ,  Chien-Hsun PAN ,  Yen-Yu CHEN ,  Yi-Ming DAI

IPC分类号： C25D21/06 ,  B01D61/18 ,  B01D63/16

摘要： The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

公开(公告)号：US20230332322A1

公开(公告)日：2023-10-19

申请号：US18340299

申请日：2023-06-23

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Zong-Kun LIN ,  Hsuan-Chih CHU ,  Chien-Hsun PAN ,  Yen-Yu CHEN ,  Yi-Ming DAI

IPC分类号： C25D21/06 ,  B01D61/18 ,  B01D63/16

CPC分类号： C25D21/06 ,  B01D61/18 ,  B01D63/16 ,  B01D2311/2642 ,  B01D2313/18 ,  B01D2313/22 ,  B01D2313/44

摘要： The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.