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1.发明申请Aqueous Solution and Method for Removing Ionic Contaminants from the Surface of a Workpiece 审中-公开水溶液和从工件表面去除离子污染物的方法公开(公告)号：US20080200360A1
公开(公告)日：2008-08-21
申请号：US11995138
申请日：2006-08-21
CPC分类号： H05K3/26 , C11D7/261 , C11D7/3218 , C11D7/5013 , C11D7/5022 , C11D11/0047 , G03F7/40 , G03F7/405 , G03F7/425 , H05K3/244 , H05K3/28 , H05K2201/0761 , H05K2203/122
摘要： To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof.
摘要翻译： 为了减少至少部分地被阻焊掩模覆盖的印刷电路板上的离子污染物，并且在铜结构上设置有顶层，使用含水清洗溶液，其含有至少一种乙醇胺化合物和/或其盐 ，至少一种醇溶剂和需要的至少一种胍化合物和/或其盐。
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2.发明申请METHOD FOR COATING SUBSTRATES CONTAINING ANTIMONY COMPOUNDS WITH TIN AND TIN ALLOYS 审中-公开涂有含钛和钛合金的抗微生物化合物的基材的方法公开(公告)号：US20090081370A1
公开(公告)日：2009-03-26
申请号：US11661237
申请日：2005-08-25
IPC分类号： B05D3/10
CPC分类号： C23C18/48 , C23C18/1844 , H05K3/244 , H05K2203/0392
摘要： The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask.
摘要翻译： 本发明涉及一种用于在含有锑化合物作为防火剂的基材上沉积锡或锡合金层或提高冲压性的方法，其中在金属化之前通过酸溶液从基材表面除去锑化合物。 特别优选使用含有盐酸的预处理溶液用于此目的。 该方法特别适用于在含有锑化合物的印刷电路板上生产可接合的锡最终层，锡末端层被施加到未被阻焊掩模覆盖的导体图案的铜部分上。
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