公开(公告)号：US20190070640A1

公开(公告)日：2019-03-07

申请号：US16182429

申请日：2018-11-06

申请人： LIFE TECHNOLOGIES CORPORATION

发明人： James A. Ball ,  Phil Waggoner ,  Scott Parker

IPC分类号： B08B3/08 ,  C11D11/00 ,  B08B9/08 ,  C11D1/22 ,  C11D3/16 ,  C11D3/43 ,  H01L21/02 ,  G01N27/414 ,  C11D3/34 ,  B05D5/12 ,  C11D7/34 ,  C11D7/50 ,  B05D3/00

CPC分类号： B08B3/08 ,  B05D3/00 ,  B05D5/12 ,  B08B9/08 ,  C11D1/22 ,  C11D3/162 ,  C11D3/3418 ,  C11D3/43 ,  C11D7/34 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L21/02057

摘要： A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

公开(公告)号：US10035978B2

公开(公告)日：2018-07-31

申请号：US15124478

申请日：2015-04-20

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Toshiyuki Oie ,  Kenji Shimada

IPC分类号： C11D7/06 ,  C11D11/00 ,  H01L21/304 ,  B08B3/08 ,  C11D7/32 ,  C11D7/50 ,  H01L21/02 ,  H01L21/3065 ,  H01L21/308 ,  C11D3/39 ,  C11D7/10 ,  C11D7/12

CPC分类号： C11D11/0047 ,  B08B3/08 ,  C11D3/3947 ,  C11D7/06 ,  C11D7/10 ,  C11D7/105 ,  C11D7/12 ,  C11D7/3209 ,  C11D7/5004 ,  C11D7/5009 ,  C11D7/5013 ,  C11D7/5022 ,  H01L21/02057 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/3085

摘要： The present invention makes it possible to provide a semiconductor element cleaning method that is characterized in that: a hard mask pattern is formed on a substrate that has a low relative permittivity film and at least one of a cobalt, a cobalt alloy, or a tungsten plug; and a cleaning liquid that contains 0.001-20% by mass of an alkali metallic compound, 0.1-30% by mass of quaternary ammonium hydroxide, 0.01-60% by mass of a organic water-soluble solvent, 0.0001-0.1% by mass of hydrogen peroxide, and water is subsequently used on a semiconductor element in which, using the hard mask pattern as a mask, the hard mask, the low relative permittivity film, and a barrier insulating film are dry etched, and dry etch residues are removed.

公开(公告)号：US20180187133A1

公开(公告)日：2018-07-05

申请号：US15855362

申请日：2017-12-27

申请人： TOKYO OHKA KOGYO CO., LTD.

发明人： Takumi Namiki ,  Takayuki Haraguchi ,  Yu-Geng Wu

IPC分类号： C11D7/32 ,  C11D7/26 ,  C11D11/00 ,  H01L21/02

CPC分类号： C11D7/3218 ,  C11D7/06 ,  C11D7/261 ,  C11D7/3209 ,  C11D7/5013 ,  C11D11/0041 ,  C11D11/0047 ,  H01L21/02068

摘要： A cleaning liquid having an excellent corrosion inhibition function, and a method for manufacturing the same. The cleaning liquid contains alkanol hydroxyamine represented by general formula (1), and a basic compound other than the alkanol hydroxyamine. In the formula, Ra1 and Ra2 each independently represents a C1-C10 alkyl group having one to three hydroxy groups, or a hydrogen atom, and Ra1 and Ra2 are not simultaneously a hydrogen atom.

公开(公告)号：US09862190B2

公开(公告)日：2018-01-09

申请号：US15137151

申请日：2016-04-25

申请人： CANON KABUSHIKI KAISHA

发明人： Kyosuke Nagaoka

IPC分类号： H01L21/02 ,  B41J2/16 ,  B08B3/08 ,  C11D7/10 ,  C11D7/50 ,  C11D7/08

CPC分类号： B41J2/1631 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  C11D7/08 ,  C11D7/10 ,  C11D7/5004 ,  C11D7/5009 ,  C11D7/5013 ,  C11D7/5022 ,  H01L21/02063

摘要： A method for manufacturing a liquid ejection head including a substrate having a terminal for electrical connection to an external device, an inorganic material layer on the substrate, and a flow path member disposed on the inorganic material layer and containing an organic material, and the manufacturing method includes a cleaning step of removing a silane coupling agent attached to the terminal by using a solution containing hydrogen fluoride, ammonium fluoride, and a water-soluble organic solvent.

公开(公告)号：US09790455B2

公开(公告)日：2017-10-17

申请号：US13614461

申请日：2012-09-13

申请人： Gregg Motsenbocker

发明人： Gregg Motsenbocker

IPC分类号： C11D3/26 ,  C11D3/50 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50

CPC分类号： C11D3/50 ,  C11D7/263 ,  C11D7/264 ,  C11D7/265 ,  C11D7/3245 ,  C11D7/5013

摘要： A Low-VOC, water-based cleaner containing Baypure CX 100/34 or EDTA Versene 100, Glycol Ether DPNP, or glycol ether EB and DB, Acetone, Acetic Acid, and fragrance. The VOC content of this composition is selectable to be 3.0% or 0% (zero).

公开(公告)号：US20170076939A1

公开(公告)日：2017-03-16

申请号：US15310647

申请日：2015-05-12

申请人： BASF SE

发明人： Jerry Jhih-Jheng KE ,  Tse Wei YU ,  Yi-Ping CHENG

IPC分类号： H01L21/02 ,  C11D3/37 ,  C11D3/39 ,  H01L21/311 ,  C11D7/32 ,  C11D7/34 ,  C11D7/50 ,  C09K13/00 ,  C11D11/00 ,  C11D7/26

CPC分类号： H01L21/02063 ,  C09K13/00 ,  C11D3/3723 ,  C11D3/3942 ,  C11D3/3947 ,  C11D7/263 ,  C11D7/32 ,  C11D7/34 ,  C11D7/5009 ,  C11D7/5013 ,  C11D11/0047 ,  C11D17/041 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/32134

摘要： The present invention relates to a novel composition that may be used to control the etching rate of TIN with respect to W, and remove any residues from the surface, e.g. organic or inorganic residues that could contain fluorine (F), which composition comprises a) an aliphatic or aromatic sulfonic acid; b) one or more inhibitor(s); c) an aprotic solvent; d) a glycol ether; and e) water. The present invention also relates to a kit comprising said composition in combination with an oxidant and optionally a stabilizer of the oxidant, and the use thereof.

摘要翻译： 本发明涉及可用于控制TIN相对于W的蚀刻速率并从表面去除任何残留物的新型组合物，例如， 可以含氟（F）的有机或无机残留物，该组合物包含a）脂族或芳族磺酸; b）一种或多种抑制剂; c）非质子溶剂; d）乙二醇醚; 和e）水。 本发明还涉及包含所述组合物与氧化剂和任选的氧化剂稳定剂组合的试剂盒及其用途。

公开(公告)号：US09555451B2

公开(公告)日：2017-01-31

申请号：US15079532

申请日：2016-03-24

申请人： LIFE TECHNOLOGIES CORPORATION

发明人： James A. Ball ,  Phil Waggoner ,  Scott Parker

IPC分类号： B08B7/00 ,  B08B3/08 ,  B08B9/08 ,  C11D3/16 ,  C11D3/34 ,  C11D3/43 ,  G01N27/414 ,  C11D7/50 ,  C11D7/34

CPC分类号： B08B3/08 ,  B05D3/00 ,  B05D5/12 ,  B08B9/08 ,  C11D1/22 ,  C11D3/162 ,  C11D3/3418 ,  C11D3/43 ,  C11D7/34 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L21/02057

摘要： A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

摘要翻译： 一种处理包括多个传感器和隔离结构的传感器阵列的方法，其中所述多个传感器中的传感器具有在所述传感器阵列的表面处暴露的传感器垫，并且所述隔离结构设置在所述传感器垫和传感器垫之间 所述多个传感器中的其它传感器包括将所述传感器垫和所述隔离结构暴露于包括有机硅化合物和第一非水载体的非水有机硅溶液; 将包含有机酸和第二非水性载体的酸溶液施加到传感器垫; 以及从传感器垫和隔离结构冲洗酸溶液。

公开(公告)号：US09536730B2

公开(公告)日：2017-01-03

申请号：US14010748

申请日：2013-08-27

申请人： AIR PRODUCTS AND CHEMICALS INC.

发明人： Yi Chia Lee ,  Madhukar Bhaskara Rao ,  Gautam Banerjee ,  Wen Dar Liu ,  Aiping Wu ,  Seiji Inaoka

IPC分类号： C11D7/50 ,  H01L21/02 ,  C11D7/10 ,  C11D7/26 ,  C11D7/32 ,  G03F7/42

CPC分类号： H01L21/02052 ,  C11D7/10 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3218 ,  C11D7/3281 ,  C11D7/5013 ,  C11D7/5022 ,  G03F7/425 ,  G03F7/426

摘要： A composition and method for removing copper-containing post-etch and/or post-ash residue from patterned microelectronic devices is described. The removal composition includes water, a water-miscible organic solvent, an amine compound, an organic acid, and a fluoride ion source. The compositions effectively remove the copper-containing post-etch residue from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials.

摘要翻译： 描述了从图案化的微电子器件去除含铜的后蚀刻和/或后灰渣残留物的组合物和方法。 除去组合物包括水，水混溶性有机溶剂，胺化合物，有机酸和氟离子源。 组合物有效地从微电子器件中去除含铜的蚀刻后残留物，而不损害暴露的低k电介质和金属互连材料。

公开(公告)号：US09392785B2

公开(公告)日：2016-07-19

申请号：US14249021

申请日：2014-04-09

申请人： RHODIA OPERATIONS

发明人： Olivier Jentzer ,  Massimo Guglieri

IPC分类号： A01N25/02 ,  C07C231/02 ,  C07C233/05 ,  C09D7/00 ,  C09D9/00 ,  C09D11/033 ,  C11D3/32 ,  C11D3/43 ,  C11D7/32 ,  C11D7/50 ,  C07C231/14 ,  C07C235/74 ,  C08K5/20

CPC分类号： A01N25/02 ,  C07C231/02 ,  C07C231/14 ,  C07C233/05 ,  C07C235/74 ,  C08K5/20 ,  C09D7/20 ,  C09D9/005 ,  C09D11/033 ,  C11D3/32 ,  C11D3/43 ,  C11D7/3263 ,  C11D7/5013 ,  A01N33/22 ,  A01N37/26 ,  A01N43/653 ,  A01N47/22 ,  A01N47/24 ,  A01N53/00 ,  A01N57/12 ,  A01N57/16

摘要： One subject of the present invention is the use, as solvents, of compounds of esteramide type. Another subject of the invention are particularly practical processes for preparing esteramides. Another subject of the invention are novel esteramides, which may in particular be used as solvents, for example in phytosanitary formulations.

摘要翻译： 本发明的一个主题是使用酯酰胺类化合物作为溶剂。 本发明的另一主题是制备酯酰胺的特别实用的方法。 本发明的另一主题是新的酯酰胺，其可特别用作溶剂，例如在植物检疫制剂中。

公开(公告)号：US09303239B2

公开(公告)日：2016-04-05

申请号：US13778810

申请日：2013-02-27

申请人： SHIMADZU CORPORATION

发明人： Akihiro Arai

IPC分类号： B08B3/08 ,  B08B3/04 ,  B08B9/00 ,  C11D7/50 ,  C11D7/26 ,  C11D7/28 ,  C11D7/34 ,  C11D11/00 ,  B01L3/00 ,  G01N27/447 ,  G01N30/60

CPC分类号： C11D7/5022 ,  B01L3/502753 ,  B08B3/04 ,  B08B3/08 ,  B08B9/00 ,  C11D7/265 ,  C11D7/28 ,  C11D7/34 ,  C11D7/5004 ,  C11D7/5013 ,  C11D11/0023 ,  G01N27/44791 ,  G01N30/6095

摘要： The present invention provides a cleaning method by which the performance of a microchip can be recovered and a cleaning liquid. A method for cleaning a microfluidic device comprising: cleaning a channel that is formed in the microfluidic device, has a surface having a polymer coating, and has been brought into contact with a sample containing nucleic acid and/or protein, by bringing the channel into contact with a cleaning liquid comprised only of an organic solvent having solubility in at least the same volume of water at 25° C., or a cleaning liquid containing 50 vol % or more of the organic solvent in a buffer solution. The method wherein the buffer solution has a pH of 8 to 10. The method wherein the buffer solution further contains 3 to 8M of a protein denaturant. The method wherein the buffer solution has a pH of 2 to 4.

摘要翻译： 本发明提供一种能够回收微芯片性能的清洗方法和清洗液。 一种用于清洁微流体装置的方法，包括：清洁在微流体装置中形成的通道，具有聚合物涂层的表面，并且已经与含有核酸和/或蛋白质的样品接触，通过使通道进入 与仅在25℃下至少相同体积的水中溶解的有机溶剂的清洗液或在缓冲溶液中含有50体积％以上有机溶剂的清洗液接触。 其中缓冲溶液的pH为8〜10的方法，其中缓冲液还含有3〜8M的蛋白质变性剂。 缓冲溶液的pH为2〜4的方法。