公开(公告)号：US20100270688A1

公开(公告)日：2010-10-28

申请号：US12430608

申请日：2009-04-27

申请人： Ting-Feng SU ,  Chien-Ming Chen

发明人： Ting-Feng SU ,  Chien-Ming Chen

IPC分类号： H01L23/538

CPC分类号： H01L25/0657 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/50 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4899 ,  H01L2224/73265 ,  H01L2224/83856 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip stacked package primarily comprises a chip carrier, a first chip disposed on the chip carrier, a plurality of die-attaching bars, a second chip stacked on the first chip by the adhesion of the die-attaching bars, and a plurality of bonding wires electrically connecting the first chip to the chip carrier. The die-attaching bars are formed on the first chip in a specific pattern and have an adhesive surface away from the first chip for adhering the second chip. The bonding wires have a loop height lower than the adhesive surface in a manner that specific sections of the bonding wires are embedded in the corresponding die-attaching bar from the adhesive surface. Accordingly, the die-attaching bars can modify and fasten the bonding wires in advance to avoid collapse and deformation of the bonding wires during stacking of the second chip and encapsulating processes.

摘要翻译： 多芯片堆叠封装主要包括芯片载体，设置在芯片载体上的第一芯片，多个芯片连接杆，通过模具附接杆的粘附堆叠在第一芯片上的第二芯片，以及多个芯片 的电线将第一芯片电连接到芯片载体上。 模具安装杆以特定图案形成在第一芯片上，并且具有远离第一芯片的粘合表面，用于粘附第二芯片。 接合线具有低于粘合剂表面的环高度，使得接合线的特定部分从粘合剂表面嵌入相应的模具附接杆中。 因此，模具安装杆可以预先修改并固定接合线，以避免在第二芯片堆叠和封装过程期间接合线的塌陷和变形。