公开(公告)号：US20230230862A1

公开(公告)日：2023-07-20

申请号：US18153469

申请日：2023-01-12

Applicant: Tokyo Electron Limited

Inventor： Kiyoshi SUZUKI ,  Hiroshi HIROSE ,  Ryota GOTO ,  Koichi MIYASHITA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/683

CPC classification number: H01L21/67201 ,  H01L21/67742 ,  H01L21/6719 ,  H01L21/6838 ,  H01L21/67259 ,  H01L21/67745

Abstract: A substrate transport method is employed in a substrate processing system including a plurality of processing chambers, a load lock chamber, a vacuum transport device provided in a vacuum transport chamber connecting the load lock chamber and the plurality of processing chambers and configured to simultaneously transport a plurality of substrates, and an atmospheric transport device provided in an atmospheric transport chamber and configured to transport a substrate from a carrier to the load lock chamber. The substrate transport method includes acquiring in advance a relative positional error for a case where the plurality of substrates are transported from the load lock chamber to the plurality of processing chambers and placed on a stage in the plurality of processing chambers, and placing the plurality of substrates on a stage in the load lock chamber, based on a transport path of the plurality of substrates and the relative positional error.