公开(公告)号：US20210305029A1

公开(公告)日：2021-09-30

申请号：US17208445

申请日：2021-03-22

Applicant: Tokyo Electron Limited

Inventor： Koichi MIYASHITA ,  Makoto HORIKAWA ,  Satoshi GOMI

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/52 ,  C23C16/455 ,  C23C16/50 ,  C23C16/08 ,  C23C16/34

Abstract: According to one embodiment of the present disclosure, there is provided a substrate processing system for processing a plurality of substrates including: a processor configured to perform a process on the substrate; a transport device configured to repeatedly transport the plurality of substrates with respect to the processor; and a controller configured to control the process of the substrate in the processor, wherein the controller is configured to: execute the process based on a process recipe, which is a control program for executing the process; and set an offset time, which is a function corresponding to a number of the substrates processed by the processor or a function corresponding to a parameter equivalent to the number of the processed substrates, with respect to a step time for a step of the process recipe.

公开(公告)号：US20230230862A1

公开(公告)日：2023-07-20

申请号：US18153469

申请日：2023-01-12

Applicant: Tokyo Electron Limited

Inventor： Kiyoshi SUZUKI ,  Hiroshi HIROSE ,  Ryota GOTO ,  Koichi MIYASHITA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/683

CPC classification number: H01L21/67201 ,  H01L21/67742 ,  H01L21/6719 ,  H01L21/6838 ,  H01L21/67259 ,  H01L21/67745

Abstract: A substrate transport method is employed in a substrate processing system including a plurality of processing chambers, a load lock chamber, a vacuum transport device provided in a vacuum transport chamber connecting the load lock chamber and the plurality of processing chambers and configured to simultaneously transport a plurality of substrates, and an atmospheric transport device provided in an atmospheric transport chamber and configured to transport a substrate from a carrier to the load lock chamber. The substrate transport method includes acquiring in advance a relative positional error for a case where the plurality of substrates are transported from the load lock chamber to the plurality of processing chambers and placed on a stage in the plurality of processing chambers, and placing the plurality of substrates on a stage in the load lock chamber, based on a transport path of the plurality of substrates and the relative positional error.

公开(公告)号：US20230135618A1

公开(公告)日：2023-05-04

申请号：US17912201

申请日：2021-03-12

Applicant: Tokyo Electron Limited

Inventor： Hiroshi HIROSE ,  Masaomi KOBE ,  Koichi MIYASHITA ,  Takafumi NOGAMI ,  Kenichi KOTE ,  Kouji IIHOSHI

IPC: C23C16/52 ,  C23C16/44 ,  C23C16/511 ,  H01J37/32

Abstract: A substrate processing method includes: a step of preparing a substrate in a chamber of a substrate processing apparatus; a step of correcting a set power value based on a correction value Y from Equation (1), coefficients A, B, C, and D, and a variable X indicating a processed amount of the substrates having been subjected to continuous film formation processes, referring to a storage in which the coefficients A, B, C, and D of the Equation (1) used to calculate the correction value Y for the set power value are stored; and a step of processing the prepared substrate by applying power with the corrected power value into the chamber, the Equation (1) is expressed as Y=Aexp(BX)+CX+D, where at least one of the coefficients A, C, and D is not zero, and when the coefficient A is not zero, the coefficient B is also not zero.

公开(公告)号：US20200328100A1

公开(公告)日：2020-10-15

申请号：US16838292

申请日：2020-04-02

Applicant: Tokyo Electron Limited

Inventor： Katsuhito HIROSE ,  Koichi MIYASHITA ,  Hiroshi HIROSE ,  Satoshi GOMI ,  Yasunori KUMAGAI ,  Takashi YOSHIYAMA

IPC: H01L21/67 ,  H01L21/02 ,  G05B19/418

Abstract: A processing apparatus for processing a substrate includes: a plurality of end devices; a low-level controller configured to control specific end devices among the plurality of end devices; and a module controller configured to execute a recipe for processing the substrate, to specify control steps satisfying a specific condition among a plurality of control steps of the recipe, and to transmit the specified control steps to the low-level controller, wherein the low-level controller controls the specific end devices based on the control steps received from the module controller.