公开(公告)号：US20180240695A1

公开(公告)日：2018-08-23

申请号：US15901954

申请日：2018-02-22

Applicant: Tokyo Electron Limited

Inventor： Tokutarou Hayashi ,  Hiroki Harada ,  Akihiro Teramoto ,  Tooru Tokimatu ,  Masahiro Abe ,  Kazutoshi Ishimaru

IPC: H01L21/677 ,  G03F7/16 ,  G03F7/20 ,  B65G43/08 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67706 ,  B65G43/08 ,  G03F7/162 ,  G03F7/70733 ,  H01L21/67051 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/681 ,  H01L21/68707

Abstract: A device includes a substrate holding unit 25 configured to hold a substrate and be movable in a transversal direction to transfer the substrate from one module to another module; a first detecting unit 3 configured to detect a position of the substrate on the substrate holding unit 25 before the substrate holding unit 25 transfers the substrate into the another module after receiving the substrate from the one module; second detecting units 55 and 56 configured to detect a position deviation between a position of the substrate holding unit 25, which is located at a temporary position set to transfer the substrate into the another module, and the temporary position; and a position determining unit 10 configured to determine a transfer position where the substrate is transferred into the another module based on the position of the substrate on the substrate holding unit 25 and the position deviation.

公开(公告)号：US20170358464A1

公开(公告)日：2017-12-14

申请号：US15619920

申请日：2017-06-12

Applicant: Tokyo Electron Limited

Inventor： Masahiro Abe ,  Hiroichi Inada ,  Tohru Azuma ,  Tsunenaga Nakashima ,  Naofumi Kishita ,  Hideki Kajiwara

IPC: H01L21/67 ,  G03F7/16 ,  H01L21/677

CPC classification number: H01L21/6715 ,  G03F7/162

Abstract: Disclosed is a liquid processing apparatus including: a plurality of substrate placement regions; a nozzle that supplies a processing liquid to a substrate from each processing position; a nozzle placement region provided behind a row of the substrate placement regions; an arm that detachably holds the nozzle at one end side; a driving unit that horizontally pivots the arm around a pivot axis; and a controller that outputs a control signal to convey the nozzle from the nozzle placement region to a standby position corresponding to a processing position of a conveyance destination, cause the nozzle to stand by at the standby position, and then, convey the nozzle to the processing position. The standby position is outside the substrate placement regions and is located between the processing position and the nozzle placement region when viewed in a front-and-rear direction.