公开(公告)号：US20230402303A1

公开(公告)日：2023-12-14

申请号：US18333019

申请日：2023-06-12

Applicant: Tokyo Electron Limited

Inventor： Tsunenaga Nakashima ,  Hiroaki Inadomi

IPC: H01L21/67 ,  H01L21/3065 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67069 ,  H01L21/3065 ,  H01L21/67034 ,  H01L21/02101 ,  H01L21/6773 ,  H01L21/67178 ,  H01L21/67201 ,  H01L21/67748 ,  H01L21/67757

Abstract: A substrate processing apparatus includes a liquid processing apparatus configured to form a liquid film on a surface of a substrate; a supercritical drying apparatus configured to dry the substrate by replacing the liquid film with a supercritical fluid; a first load-lock apparatus configured to switch an atmosphere around the substrate from a first one of a normal pressure atmosphere and a decompressed pressure atmosphere to a second one thereof on a transfer path of the substrate; a dry-cleaning apparatus configured to dry-clean the surface of the substrate under a decompressed pressure; and a control device configured to perform forming of the liquid film by the liquid processing apparatus, drying of the substrate by the supercritical drying apparatus, switching of the atmosphere around the substrate by the first load-lock apparatus, and dry-cleaning of the substrate by the dry-cleaning apparatus in this order.

公开(公告)号：US09984905B2

公开(公告)日：2018-05-29

申请号：US15252422

申请日：2016-08-31

Applicant: Tokyo Electron Limited

Inventor： Masahiro Nakaharada ,  Yoji Sakata ,  Akira Miyata ,  Shinichi Hayashi ,  Suguru Enokida ,  Tsunenaga Nakashima

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/02 ,  H01L21/66 ,  G03F7/20

CPC classification number: H01L21/67051 ,  G03F7/70691 ,  H01L21/02043 ,  H01L21/67046 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67213 ,  H01L21/67225 ,  H01L21/67242 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67706 ,  H01L21/67748 ,  H01L21/6875 ,  H01L22/20

Abstract: An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.

公开(公告)号：US09984904B2

公开(公告)日：2018-05-29

申请号：US15252374

申请日：2016-08-31

Applicant: Tokyo Electron Limited

Inventor： Masahiro Nakaharada ,  Yoji Sakata ,  Akira Miyata ,  Shinichi Hayashi ,  Suguru Enokida ,  Tsunenaga Nakashima

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/02 ,  H01L21/66 ,  G03F7/20

CPC classification number: H01L21/67051 ,  G03F7/70691 ,  H01L21/02043 ,  H01L21/67046 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67213 ,  H01L21/67225 ,  H01L21/67242 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67706 ,  H01L21/67748 ,  H01L21/6875 ,  H01L22/20

Abstract: An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.

公开(公告)号：US09460942B2

公开(公告)日：2016-10-04

申请号：US13663846

申请日：2012-10-30

Applicant: Tokyo Electron Limited

Inventor： Masahiro Nakaharada ,  Yoji Sakata ,  Akira Miyata ,  Shinichi Hayashi ,  Suguru Enokida ,  Tsunenaga Nakashima

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67051 ,  G03F7/70691 ,  H01L21/02043 ,  H01L21/67046 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67213 ,  H01L21/67225 ,  H01L21/67242 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67706 ,  H01L21/67748 ,  H01L21/6875 ,  H01L22/20

Abstract: An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.

Abstract translation: 涂装和显影处理系统的界面站具有：在将晶片转移到曝光装置之前，清洁单元至少清洁晶片的后表面; 检查单元，在将其转印到曝光装置之前，检查清洁晶片的背面是否可曝光; 晶片传送机构包括在晶片传送机构之间转移晶片的晶片传送控制部件。 当通过检查结果确定晶片的状态通过重新清洁在清洁单元中时，晶片转移控制部分控制晶片传送机构将晶片再次传送到清洁单元。

公开(公告)号：US11630392B2

公开(公告)日：2023-04-18

申请号：US16666717

申请日：2019-10-29

Applicant: Tokyo Electron Limited

Inventor： Tsunenaga Nakashima

IPC: G03F7/30 ,  G03F7/16 ,  H01L21/67 ,  H01L21/677

Abstract: In a chemical liquid container replacement device D2 configured to replace a chemical liquid container 50, multiple chemical liquid containers 50 respectively connected to base end sides of chemical liquid supply paths configured to supply chemical liquids, and a nozzle attachment/detachment device 61 is configured to attach/detach the base end side of the chemical liquid supply path with respect to the chemical liquid container 50 of a container arrangement section 60. A loading/unloading port 62 loads a new chemical liquid container 50 for performing a liquid process on a substrate W and unloads a completely used chemical liquid container 50. A container transfer device 7 unloads the completely used chemical liquid container 50 from the container arrangement section 60 toward the loading/unloading port 62 and loads the new chemical liquid containers 50 from the loading/unloading port 62 toward the container arrangement section 60.

公开(公告)号：US20220399210A1

公开(公告)日：2022-12-15

申请号：US17755446

申请日：2020-10-19

Applicant: Tokyo Electron Limited

Inventor： Tsunenaga Nakashima ,  Masami Akimoto

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B5/02 ,  B05B1/00

Abstract: A particle removed from a substrate is suppressed from adhering to the substrate again. A substrate cleaning apparatus includes a substrate holder configured to hold the substrate; a gas nozzle configured to jet a cleaning gas to the substrate on the substrate holder; and a nozzle cover provided to surround the gas nozzle. The cleaning gas is jetted to a decompression chamber of the nozzle cover from the gas nozzle, and a gas cluster configured to remove the particle on the substrate in the decompression chamber is generated. A gas for a gas curtain is jetted from an end portion of the nozzle cover toward the substrate, and the gas curtain is formed between the substrate and the end portion of the nozzle cover.

公开(公告)号：US11865590B2

公开(公告)日：2024-01-09

申请号：US18048102

申请日：2022-10-20

Applicant: Tokyo Electron Limited

Inventor： Kyoko Ikeda ,  Kazuya Dobashi ,  Tsunenaga Nakashima ,  Kenji Sekiguchi ,  Shuuichi Nishikido ,  Masato Nakajo ,  Takahiro Yasutake

IPC: B08B5/02 ,  H01L21/02

CPC classification number: B08B5/02 ,  H01L21/02041

Abstract: A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.

公开(公告)号：US11504751B2

公开(公告)日：2022-11-22

申请号：US17295971

申请日：2019-11-20

Applicant: Tokyo Electron Limited

Inventor： Kyoko Ikeda ,  Kazuya Dobashi ,  Tsunenaga Nakashima ,  Kenji Sekiguchi ,  Shuuichi Nishikido ,  Masato Nakajo ,  Takahiro Yasutake

IPC: H01L21/02 ,  B08B5/02

Abstract: A substrate processing device includes a processing container; a substrate holder configured to hold a substrate arranged within the processing container; a gas nozzle configured to spray gas within the processing container; a controller configured to control collision of the gas with the substrate held by the substrate holder. The controller is configured to remove particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.

公开(公告)号：US10807027B2

公开(公告)日：2020-10-20

申请号：US16117664

申请日：2018-08-30

Applicant: Tokyo Electron Limited

Inventor： Katsunori Ichino ,  Tsunenaga Nakashima ,  Hideo Funakoshi ,  Nobuaki Matsuoka ,  Masayuki Kajiwara

IPC: B01D36/00 ,  B01D35/26 ,  B05C11/10 ,  B05C5/00 ,  G03F7/20 ,  H01L21/67 ,  G03F7/30 ,  G03F7/16 ,  H01L21/027

Abstract: A treatment solution supply apparatus to supply a treatment solution to a treatment solution discharge unit via a supply path that is provided with a filter configured to remove foreign substances in the treatment solution and a tubephragm pump to send the treatment solution, the supply path has an opening/closing valve on an upstream side of the tubephragm pump and the filter, and a suck-back valve on a downstream side of the tubephragm pump and the filter, and includes a control unit to control at least the tubephragm pump, the opening/closing valve, and the suck-back valve, wherein the control unit performs: a control of stopping sending of the treatment solution from the tubephragm pump; and a control of suspending discharge of the treatment solution from the treatment solution discharge unit by operation of the suck-back valve, and then closing the opening/closing valve to stop the discharge.

公开(公告)号：US20200064741A1

公开(公告)日：2020-02-27

申请号：US16666717

申请日：2019-10-29

Applicant: Tokyo Electron Limited

Inventor： Tsunenaga Nakashima

IPC: G03F7/30 ,  G03F7/16

Abstract: In a chemical liquid container replacement device D2 configured to replace a chemical liquid container 50, multiple chemical liquid containers 50 respectively connected to base end sides of chemical liquid supply paths configured to supply chemical liquids, and a nozzle attachment/detachment device 61 is configured to attach/detach the base end side of the chemical liquid supply path with respect to the chemical liquid container 50 of a container arrangement section 60. A loading/unloading port 62 loads a new chemical liquid container 50 for performing a liquid process on a substrate W and unloads a completely used chemical liquid container 50. A container transfer device 7 unloads the completely used chemical liquid container 50 from the container arrangement section 60 toward the loading/unloading port 62 and loads the new chemical liquid containers 50 from the loading/unloading port 62 toward the container arrangement section 60.