公开(公告)号：US20240006214A1

公开(公告)日：2024-01-04

申请号：US18345100

申请日：2023-06-30

Applicant: Tokyo Electron Limited

Inventor： Shingo Katsuki ,  Kenichirou Matsuyama ,  Sho Kano ,  Saori Kosaki

IPC: H01L21/677 ,  H01L21/67 ,  B65G47/90

CPC classification number: H01L21/67727 ,  H01L21/67173 ,  B65G47/90

Abstract: A substrate transfer method performed in a substrate processing apparatus including a transfer mechanism group configured to transfer a substrate into a carrier via a module group and an exposure apparatus is provided. The transfer mechanism group includes a first transfer mechanism configured to transfer the substrate in an order of the pre-stage module, the exposure apparatus, and a first post-stage module, and a second transfer mechanism configured to transfer the substrate in an order of the first post-stage module, a heating module, a developing module, and a second post-stage module, a post-stage transfer mechanism. The substrate transfer method includes comparing an exposure apparatus cycle time with a section transfer time required to transfer the substrate from a transfer section by the second transfer mechanism to a transfer section by the post-stage transfer mechanism; and setting the section transfer time based on a result of the comparing.

公开(公告)号：US20240006205A1

公开(公告)日：2024-01-04

申请号：US18345073

申请日：2023-06-30

Applicant: Tokyo Electron Limited

Inventor： Kenichirou Matsuyama ,  Sho Kano

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67225 ,  H01L21/67745 ,  H01L21/6715

Abstract: A substrate transfer method performed in a substrate processing apparatus including a transfer mechanism group configured to transfer a substrate into a carrier via a module group and an exposure apparatus is provided. The transfer mechanism group includes a first transfer mechanism configured to transfer the substrate in an order of a pre-stage module, the exposure apparatus, and a first post-stage module, and a second transfer mechanism configured to transfer the substrate in an order of the first post-stage module, a heating module, a developing module, and a second post-stage module, and a post-stage transfer mechanism. The substrate transfer method includes acquiring a section transfer time required to transfer the substrate to a next transfer section; and performing a carry-in or a carry-out of the substrate into/from the exposure apparatus based on a maximum section transfer time, which is the longest in the acquired section transfer times.