公开(公告)号：US20240419885A1

公开(公告)日：2024-12-19

申请号：US18535103

申请日：2023-12-11

Applicant: Tokyo Electron Limited

Inventor： Yan CHEN ,  Vi VUONG ,  Xinkang TIAN ,  Francisco MACHUCA

IPC: G06F30/398 ,  G06F119/18

Abstract: A method of film thickness modeling includes receiving optical data of a sample having a top layer and at least one underlying layer. First simulation data are obtained by inputting the optical data into a multi-layer model. When a GOF of the first simulation data is below a threshold, a simulated thickness is obtained by inputting the optical data into a top-layer model that is substantially unaffected by the at least one underlying layer. A starting point of the thickness of the multi-layer model is adjusted based on the simulated thickness. Second simulation data are obtained by inputting the optical data into the multi-layer model. When the GOF of the second simulation data is below the threshold, the starting point of the thickness in the multi-layer model is re-adjusted, and third simulation data are obtained by inputting the optical data into the multi-layer model.

公开(公告)号：US20210057195A1

公开(公告)日：2021-02-25

申请号：US16548333

申请日：2019-08-22

Applicant: Tokyo Electron Limited

Inventor： Yan CHEN ,  Xinkang TIAN ,  Vi VUONG

IPC: H01J37/32 ,  G06F17/16 ,  H01L21/3065 ,  H01L21/67

Abstract: Described is a method for determining an endpoint of an etch process using optical emission spectroscopy (OES) data as an input. OES data is acquired by a spectrometer in a plasma etch processing chamber. The acquired time-evolving spectral data is first filtered and de-meaned, and thereafter transformed into transformed spectral data, or trends, using multivariate analysis such as principal components analysis, in which previously calculated principal component weights are used to accomplish the transform. Grouping of the principal components weights into two separate groups corresponding to positive and negative natural wavelengths, creates separate signed trends (synthetic wavelengths).